Rohm and Haas Electronic Materials Cmp Holdings, Inc.

Adam Loyack

Mary Jo Kulp

David Goodro Kelly

Alan Isami Nakatani

The polishing pad is useful for polishing at least one of magnetic, optical and semiconductor substrates. The polishing pad includes a polishing layer having a polyurethane window. The polyurethane window has a cross-linked structure formed with an aliphatic or cycloaliphatic isocyanate and a polyol in a prepolymer mixture. The prepolymer mixture is reacted with a chain extender having OH or NHgroups and having an OH or NHto unreacted NCO stoichiometry less than 95%. The polyurethane window has a time dependent strain less than or equal to 0.02% when measured with a constant axial tensile load of 1 kPa at a constant temperature of 60&#xb0; C. at 140 minutes, a Shore D hardness of 45 to 90 and an optical double pass transmission of at least 15% at a wavelength of 400 nm for a sample thickness of 1.3 mm.

Creep-resistant polishing pad window

A chemical mechanical polishing pad is provided, comprising: a polishing layer having a polishing surface; and, a light stable polymeric endpoint detection window, comprising: a polyurethane reaction product of an aromatic polyamine containing amine moieties and an isocyanate terminated prepolymer polyol containing unreacted &#x2014;NCO moieties; and, a light stabilizer component comprising at least one of a UV absorber and a hindered amine light stabilizer; wherein the aromatic polyamine and the isocyanate terminated prepolymer polyol are provided at an amine moiety to unreacted &#x2014;NCO moiety stoichiometric ratio of &#x3c;95%; wherein the light stable polymeric endpoint detection window exhibits a time dependent strain of &#x2266;0.02% when measured with a constant axial tensile load of 1 kPa at a constant temperature of 60&#xb0; C. at 100 minutes and an optical double pass transmission of &#x2267;15% at a wavelength of 380 nm for a window thickness of 1.3 mm; and, wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate. Also provided is a method of polishing a substrate (preferably a semiconductor wafer) using the chemical mechanical polishing pad provided.

Growing community of inventors

Philadelphia, PA, United States of America

Adam Loyack