Applied Materials, Inc.

Adam J Wyatt

Michael C Kuchar

Michael Robert Rice

Travis Morey

Ofer Amir

Robert M McAndrew

Andrew Nguyen

Dean C Hruzek

Sushant Suresh Koshti

Edward Ng

Angela Rose Sico

Vijayabaskar Soundarrajan

Pandu Maddherla

Joseph Vincent

Mainframe with integrated lid

Mainframe of dual-robot substrate processing system

Mainframe of substrate processing system

An electronic device manufacturing system may include a loadlock. The loadlock may include a plurality of gas line heaters for providing a heated gas to the loadlock to heat a processed substrate therein. Heating a processed substrate may reduce corrosion in the loadlock and subsequent contamination of substrates therein. The loadlock may also include a plurality of embedded heaters in the loadlock housing to reduce moisture therein, further reducing corrosion and contamination. Methods of heating a substrate in a loadlock are also provided, as are other aspects.

Electronic device manufacturing systems, methods, and apparatus for heating substrates and reducing contamination in loadlocks

An equipment front end module interface of an equipment front end module including environmental controls. The equipment front end module interface includes a first mounting member configured to couple to a load lock assembly, and a flexible seal coupled to the first mounting member. The flexible seal provides sealing between the equipment front end module and the load lock assembly and also accommodates axial and other misalignment between the load lock assembly and the equipment front end module during assembly. Equipment front end modules including the equipment front end module interface and methods of assembling a load lock assembly to the equipment front end module using the equipment front end module interface are provided, as are other aspects.

Flexible equipment front end module interfaces, environmentally-controlled equipment front end modules, and assembly methods

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Round Rock, TX, United States of America

Adam J Wyatt