Raytheon Company

Thermavant Technologies, LLC

Adam D Leeds

James E Benedict

Joseph A Boswell

Tuan L Duong

Daniel A Pounds

An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.

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Santa Barbara, CA, United States of America

Adam D Leeds