Cypress Semiconductor Corporation

Adam D Fogle

David S Lehtonen

Richard Clark Blish, Ii

An electronic device includes a packaged integrated circuit having an integrated circuit die having an active surface, and a molding compound overlaying the active surface of the integrated circuit die. In a particular embodiment, the packaged integrated circuit includes at least approximately five weight percent (5 wt %) zinc relative to the molding compound. In another embodiment, the packaged integrated circuit includes approximately 0.3 &#x3bc;mol/cmof zinc in an area parallel to the active surface of the integrated circuit die.

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San Jose, CA, United States of America

Adam D Fogle