Dow Corning Corporation

Dow Global Technolgoies LLC

Dow Silicones Corporation

Dow Corning Toray Company, Ltd.

Adam C Tomasik

Randall Gene Schmidt

Ray E Drumright

Paul Joseph Popa

Gary Michael Wieber

Don Lee Kleyer

Erin B Vogel

Gerald Lawrence Witucki

Patrick J Fryfogle

Susan Machelski

Tadashi Okawa

Haruhiko Furukawa

Tomohiro Iimura

Michitaka Suto

Fumito Nishida

Yanxiang Li

Shengqing Xu

Sawako Inagaki

Alan M Piwowar

Mayumi Mizukami

Susan M Machelski

Donald L Kleyer

A curable coating composition is provided having multi-functionalized acrylic copolymer and silicone imine resin curing agents. The acrylic copolymer of the curable coating composition has, in polymerized form, epoxy functionalized groups and cure compatibility groups and the silicone imine forms an amino-functional silicone in the presence of water. The coating compositions are useful in the field of superior weatherable and durable coatings and are useful to replace isocyanate-containing polyurethane based coatings. Also provided are coated articles produced from the curable composition.

Weatherable and durable coating compositions

A curable coating composition is provided having multi-functionalized acrylic copolymer and amino-functional silicone resin curing agents. The acrylic copolymer of the curable coating composition has, in polymerized form, epoxy functionalized groups and cure compatibility groups. The coating compositions are useful in the field of superior weatherable and durable coatings and are useful to replace isocyanate-containing polyurethane based coatings. Also provided are coated articles produced from the curable composition.

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least one aryl group in a molecule and containing a metal atom selected from the group consisting of V, Ta, Nb and Ce, and (D) a hydrosilylation-reaction catalyst. The present invention can provide the curable silicone composition, which does not develop a crack by thermal aging and further can form a cured material that exhibits less yellowing.

Curable silicone composition, cured product thereof, and optical semiconductor device

An additive for a silicone encapsulant has the structure: Formula (I) wherein Rand Rare each &#x2014;O&#x2014;Si(R)(R)(R) and each of R, R, and Ris independently chosen from C-Chydrocarbyl groups, C-Calkyl groups, C-Calkenyl groups, and C-Caryl groups, and wherein Ris independently chosen from C-Chydrocarbyl groups, C-Calkyl groups, C-Calkenyl groups, and C-Caryl groups. The additive is formed using a method that includes the step of reacting iron metal or an iron (III) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an electronic component and the encapsulant disposed on the electronic component. The device is formed using a method that includes the step of disposing the encapsulant on the electronic device. 

Additive for a silicone encapsulant

An additive for a silicone encapsulant has the structure: (I) RCe(OSi&#x2014;R) I I a Rwherein a is 3 or 4, wherein Rand Rare each &#x2014;O&#x2014;Si(R)(R)(R) and each of R, R, and Ris independently chosen from C-Chydrocarbyl groups, C-Calkyl groups, C-Calkenyl groups, and C-Caryl groups, and wherein Ris independently chosen from C-Chydrocarbyl groups, C-Calkyl groups, C-Calkenyl groups, and C-Caryl groups. More specifically, the cerium is cerium (III) or (IV). The additive is formed using a method that includes the step of reacting cerium metal or a cerium (III) or (IV) compound with a hydroxyl functional organosiloxane. An encapsulant includes the additive and a polyorganosiloxane. The encapsulant can be utilized to form a device that includes an optoelectronic component and the encapsulant disposed on the optoelectronic component. The device is formed using a method that includes the step of disposing the encapsulant on the optoelectronic device.

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Mount Pleasant, MI, United States of America

Adam C Tomasik