Visteon Global Technolgoies, Inc.

Ford Motor Company Limited

Visteon Global Tech., Inc

Achyuta Achari

Mohan R Paruchuri

Lakhi Nandlal Goenka

Delin Li

Brenda Joyce Nation

Jay DeAvis Baker

Dongkai Shangguan

Robert Edward Belke

Myron Lemecha

Andrew Zachary Glovatsky

John Trublowski

Thomas Bernd Krautheim

Robert Joseph Gordon

Michael George Todd

Daniel Phillip Dailey

Vivek Amir Jairazbhoy

Richard Keith McMillan

Mark David Miller

Charles Frederick Schweitzer

Vladimir Stoica

Edward Paul McLeskey

Karen Lee Chiles

Elmer T Heiney, Iii

Alice Dawn Zitzmann

William David Hopfe

Raja-Sheker Bollampally

Lakhi N Goenke

Jason Bullock, Legal Representative

Shona Bullock, Legal Representative

A system and method for reflowing solder to interconnect a plurality of electronic components () to a substrate () is disclosed. The system includes an oven for preheating the substrate () and the plurality of electronic components () disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder (), a pallet () for supporting the substrate (), wherein the pallet () has at least one internal cavity (), and a phase-transition material () disposed within the cavity () for absorbing heat from the pallet ().

System and method for mounting electronic components onto flexible substrates

The present invention is generally directed towards a flip chip assembly. In particular a new bonding process for bonding an electronic component to the substrate is disclosed. The method comprises the steps of forming at least one solder pad on the electronic component and forming at least one bond pad on the substrate wherein the at least one bond pad has a top layer formed of a metal. Placing an underfill film on top of the at least one bond pad and heating the electronic component and the substrate. Moving the electronic component towards the substrate such that the at least one solder pad is aligned on top of the at least one bond pad and finally forming a bond between the at least one solder pad and the top layer of the at least one bond pad.

Flip-chip bonding method

A multi-layer circuit board having apertures that are selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by a polymeric material. Each of the apertures selectively receives an electrically conductive material.

Circuit board with air-bridge

An integrated engine combustion monitoring system that includes at least one structure comprising a light communication channel (LCC) and a sensor, which are embedded in a cylinder head gasket, for monitoring combustion composition, pressure, or temperature. The sensor and the LCC may be positioned between an air cavity or a material comprising a photorefractive gel or polymer. The sensor includes a sensing component that may have various shapes or configurations. The LCC comprises one or more materials, such as a polymer, which may be formed into a strand or other structural shape and incorporated into the cylinder head gasket. The other end of the LCC may be fabricated as part of one or more engine structures or it may be connected to other structures or components such as optical detectors or associated process control electronics.

Engine combustion monitoring and control with integrated cylinder head gasket combustion sensor

A method for making a multi-layer circuit board having apertures which may be selectively and electrically isolated from electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material Each of the apertures selectively receives electrically conductive material

Method for making a multi-layer circuit board assembly having air bridges supported by polymeric material

A method for making and repairing connections between first and second circuits, such as flex circuits. An article includes: a flexible dielectric substrate having first and second edges and a plurality of conductive circuit traces arranged on or within the substrate, wherein each of the traces extends from proximate the first edge to proximate the second edge Each of the circuit traces includes: a first connection feature disposed proximate the first edge a second connection feature disposed proximate the second edge and at least one third connection feature disposed between the first and second edges Each of the first, second, and third connection features is a plated through hole, a plated blind via, or a mounting pad. This article may be used to connect together the first and second circuits using the first and second connection features such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article may be cut so as to present a set of third connection features to which a new replacement circuit may be connected.

Method for the connection and repair of flex and other circuits

Method of manufacturing a multi-layer printed circuit board adapted for reduce interfacial sheer stresses includes a laminate substrate having a top layer forming a first major surface, a middle layer having a predetermined thickness and a bottom layer forming a second major surface opposed to the first major surface. Etch resists are disposed on the first and second surfaces corresponding to reverse images of desired conductor patterns. The first and second surfaces are thereafter etched and the photoresist removed. The laminate substrate is secured via a low modules adhesive layer to a major surface of a base. The middle layer of the laminate substrate is thereafter selectively etched so as to isolate selected portions of the first and second surfaces and to define inner connect regions therebetween having a height equal to the predetermined thickness.

Multi-layer printed circuit board and method of making same

A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

Method for constructing multilayer circuit boards having air bridges

A method for making multi-layer electronic circuit boards having metallized apertures which may be selectively and electrically connected to a source of ground potential.

Method for making a circuit board

A tri-metallic material for use in the manufacture of printed circuit boards is described, and the process for its manufacture is described. The tri-metallic material is a sandwich wherein a copper layer is essential the &ldquo;bread&rdquo; of the sandwich and an aluminum layer is the filling between both slices of bread. A metallic bonding and/or barrier layer is spread on the aluminum and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.

Etched tri-layer metal bonding layer

A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

Cladded material construction for etched-tri-metal circuits

A method for making a multi-layer electronic circuit board having electroplated apertures which may be selectively and electrically isolated from an electrically grounded member and further having selectively formed air bridges and/or crossover members which are structurally supported by material

Circuit board and a method for making the same

A chemical etching manufacturing system is provided for removing material from a workpiece comprising a fluid control device, wherein the fluid control device controls at least one of fluid flow and fluid pressure, a fluid injection device, and a pulsed flow of chemical etchant adapted to pulsedly contact and remove material from a workpiece, wherein the pulse of the pulsed flow of chemical etchant is controlled by the fluid control device, and the pulsed flow of chemical etchant is emitted from the fluid injection device. A method of chemical etching in a manufacturing system is also provided comprising providing a workpiece, introducing the workpiece to a pulsed flow of chemical etchant, wherein the flow of chemical etchant pulsedly contacts and removes material from the workpiece, and removing the workpiece from the pulsed flow of chemical etchant.

Pulsed etching manufacturing method and system

An article and method for making and repairing connections between first and second circuits, such as flex circuits. The article,includes: a flexible dielectric substrate,having first and second edges,, and a plurality of conductive circuit traces,arranged on or within the substrate, wherein each of the traces extends from proximate the first edge,to proximate the second edge,. Each of the circuit traces,includes: a first connection feature,disposed proximate the first edge,; a second connection feature,disposed proximate the second edge,; and at least one third connection feature,disposed between the first and second edges,. Each of the first, second, and third connection features,is a plated through hole, a plated blind via, or a mounting pad. This article,may be used to connect together the first and second circuits,using the first and second connection features,, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article,may be cut so as to present a set of third connection features,to which a new replacement circuit may be connected.

Growing community of inventors

Canton, MI, United States of America

Achyuta Achari