Globalfoundries Inc.

Abu Thomas

Yusheng Bian

Ajey Poovannummoottil Jacob

Theodore James Letavic

Andreas Daniel Stricker

Karen A Nummy

Kenneth John Giewont

Bo Peng

The present disclosure generally relates to semiconductor detectors for use in optoelectronic devices and integrated circuit (IC) chips, and methods for forming same. More particularly, the present disclosure relates to integration of semiconductor detectors with Bragg reflectors. The photodetector of the present disclosure includes a substrate, a Bragg reflector disposed on the substrate, and a semiconductor detector disposed on the Bragg reflector. The Bragg reflector includes alternating layers of a semiconductor material and a dielectric material.

Semiconductor detectors integrated with Bragg reflectors

Structures with waveguides in multiple levels and methods of fabricating a structure that includes waveguides in multiple levels. A waveguide crossing has a first waveguide and a second waveguide arranged to intersect the first waveguide. A third waveguide is displaced vertically from the waveguide crossing, The third waveguide includes a portion having an overlapping arrangement with a portion of the first waveguide. The overlapping portions of the first and third waveguides are configured to transfer optical signals between the first waveguide and the third waveguide.

Waveguide intersections incorporating a waveguide crossing

The present disclosure relates to semiconductor structures and, more particularly, to three dimensional (3D) optical interconnect structures and methods of manufacture. The structure includes: a first structure having a grating coupler and a first optical waveguide structure; and a second structure having a second optical waveguide structure in alignment with the first optical waveguide structure and which has a modal effective index that matches to the first optical waveguide structure.

Three dimensional optical interconnects

Structures for an electro-optic modulator and methods of fabricating a structure for an electro-optic modulator. An electro-optic modulator is arranged over a portion of a waveguide core. The electro-optic modulator includes an electrode, an active layer arranged adjacent to the electrode, and a dielectric layer including a portion that has a lateral arrangement between the electrode and the active layer. The active layer is composed of a material having a refractive index that is a function of a bias voltage applied to the electrode and the active layer.

Electro-optic modulators with layered arrangements

Waveguiding structures and methods of fabricating a waveguiding structure. The waveguiding structure includes a waveguide and an array of semiconductor fins that are arranged at least in part inside the waveguide.

Composite waveguiding structures including semiconductor fins

Structures including a waveguide core and methods of fabricating a structure including a waveguide core. A back-end-of-line interconnect structure includes a cap layer, an interlayer dielectric layer, and one or more metal features embedded in the interlayer dielectric layer. The interlayer dielectric layer is stacked in a vertical direction with the cap layer. The one or more metal features have an overlapping arrangement in a lateral direction with the waveguide core, which is arranged under the back-end-of-line interconnect structure.

Back-end-of-line blocking structures arranged over a waveguide core

Structures for an electro-optic modulator and methods of fabricating a structure for an electro-optic modulator. The electro-optic modulator is arranged over a portion of a first waveguide core. The electro-optic modulator may include an electrode, an active layer, a second waveguide core, and a dielectric layer that is arranged between the active layer and the second waveguide core. The active layer is composed of a material having a refractive index that is a function of a bias voltage applied between the electrode and the first waveguide core.

Electro-optic modulators with stacked metal, dielectric, and active layers

Structures including a waveguide core and methods of fabricating a structure including a waveguide core. A back-end-of-line interconnect structure has an interlayer dielectric layer and a cap layer stacked over the interlayer dielectric layer. A waveguide core includes a section arranged beneath the cap layer. The waveguide core has a first index of refraction that varies as a function of width, and the cap layer has a second index of refraction. The section of the waveguide core has a width that is selected such that the first index of refraction is substantially equal to the second index of refraction to provide phase matching effective for coupling a portion of an optical signal from the waveguide core to the cap layer.

Polarizers and polarization splitters phase-matched with a back-end-of-line layer

Structures that include an optical component, such as a grating coupler, and methods of fabricating a structure that includes an optical component, such as a grating coupler. First and second layers are arranged over the optical component with the first layer arranged between the second layer and the optical component. The first and second layers are each composed of a tunable material having a refractive index that is a function of a bias voltage applied to the first layer and the second layer.

Multiple-layer arrangements using tunable materials to provide switchable optical components

Structures that include a waveguide and methods of fabricating a structure that includes a waveguide. A tapered feature composed of a dielectric material is arranged over the waveguide. The tapered feature includes a sidewall that is angled relative to a longitudinal axis of the waveguide.

Waveguides including a patterned dielectric layer

Structures for a polarization splitter and methods of forming a polarization splitter. A multi-mode interference region includes a first waveguide and a second waveguide arranged in a stack over the first waveguide. First and second input ports are connected with the multi-mode interference region. First and second output ports are connected with the multi-mode interference region.

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Brookline, MA, United States of America

Abu Thomas