Orbotech Limited

Optrotech Ltd.

Laser Imaging Systems Gmbh & Co. Kg

Photon Dynamics, Inc.

Laser Imaging Systems Gmbh

Orbtech Ltd.

Optrotech Ltd, Israel Company

Abraham Gross

Zvi Kotler

Eliezer Lipman

Dan Alon

Stefan Heinemann

Arie Glazer

Noam Dotan

Wolfgang Retschke

Jonas Burghoff

Holger Wagner

Yigal Katzir

Erez Sali

Boris Kling

Eviatar Halevi

Ofer Saphier

Gershon Miller

Hanan Gino

Barry Ben-Ezra

Yehiam Prior

Steffen Ruecker

Amiram Caspi

Ilya Leizerson

Shimon Ullman

Raanan Adin

Ran Carmeli

Avner Karpol

Daniel Toet

Eldad Giberman

Werner Eschke

Emmanuel Elyasaf

Itzhak Taff

Alexander Kadyshevitch

Ofer Kadar

Raphael Ben-Tolila

Mannie Dorfan

Ronen Loewinger

David Bochner

Nava Shpaisman

An apparatus is used in preparing a printed circuit board (PCB). The apparatus can include a common chassis, an inkjet printer mounted on the common chassis, and a pattern exposer mounted on the common chassis. The inkjet printer can selectively print unexposed photosensitive patterns on a PCB substrate with a photosensitive ink. The pattern exposer can expose said photosensitive patterns to radiation thereby defining exposed patterns. A photosensitive ink for use in an ink jet printer can include a photoresist, a solvent, a humectant, a surfactant, an adhesion promoter, and a basic solution. The adhesion promoter is operative to increase anisotropy of a wet etching process of a copper component on which said photosensitive ink is printed.

Apparatus for use in preparing a printed circuit board and photosensitive ink for in an ink jet printer

A method of manufacture of objects including receiving a CAD file containing electrical circuit design data for direct writing on a surface, the CAD file including CAD data for a multiplicity of objects to be produced on the surface, automatically configuring a direct write machine to direct write direct writing data based on the CAD data on the surface in plural scans, each having a scan width less than a width of the surface, including arranging the direct writing data for the multiplicity of objects to be written in a side by side manner in each of the plural scans so as to be within the scan width, whereby stitching of direct writing data between adjacent scans is obviated and operating the direct write machine to create the multiplicity of objects on the surface.

Stitchless direct imaging for high resolution electronic patterning

A non-mechanical contact signal measurement apparatus includes a first conductor on a structure under test and a gas in contact with the first conductor. At least one electron beam is directed into the gas so as to induce a plasma in the gas where the electron beam passes through the gas. A second conductor is in electrical contact with the plasma. A signal source is coupled to an electrical measurement device through the first conductor, the plasma, and the second conductor when the plasma is directed on the first conductor. The electrical measurement device is responsive to the signal source.

Electrical inspection of electronic devices using electron-beam induced plasma probes

A direct imaging system comprises an illumination unit comprising a plurality of light sources, the plurality of light sources configured to emit a plurality of beams, an optical system for forming the plurality of beams to be aligned in position or angle, an acoustic optical modulator positioned to receive the plurality of beams aligned in one of position or angle and to consecutively diffract different portions of the plurality of beams as an acoustic wave propagates in an acoustic direction, and a scanning element adapted to scan an exposure plane with the plurality of beams modulated by the acoustic optical modulator at a scanning velocity, wherein the scanning velocity is selected to incoherently unite the different portions of the plurality of beams into a single exposure spot.

System and method for direct imaging

A system for delivering energy to a substrate includes a laser energy source providing a plurality of laser beams, wherein each of the beams is steered to an independently selectable location on a target, and is independently focused onto the target.

Multiple beam micro-machining system and method

An apparatus is provided for testing microelectronic components on a substrate, including a scanner operative to scan a light beam over a plurality of thin film transistors disposed on a substrate, one transistor at a time, so as to induce a photoconductive response in the plurality of transistors, one transistor at a time; current sensing circuitry operative, synchronously with said scanner, to measure an output induced by the photoconductive response associated with a transistor and to generate photoconductive response output values, the photoconductive response output values representing a photoconductive response induced by the light beam, for one transistor at a time from among the plurality of transistors; and diagnostic apparatus operative to analyze the electronic response output values and to characterize each of the transistors in accordance therewith.

Photoconductive based electrical testing of transistor arrays

A system for delivering energy to a substrate including a dynamically directable source of radiant energy providing a plurality of beams of radiation, each propagating in a dynamically selectable direction. Independently positionable beam steering elements in a plurality of beam steering elements are operative to receive the beams and direct them to selectable locations on the substrate.

Micro-machining system employing a two stage beam steering mechanism

A method for printing includes providing a substrate on which a matrix of color elements is defined, the color elements having respective center lines. A printhead assembly is positioned over the substrate. The printhead assembly includes multiple controllable nozzles. At least one of the substrate and the printhead assembly is translated so that the printhead assembly scans over the substrate in a scan direction transverse to the center lines of the color elements. Droplets of ink are ejected from the nozzles onto the substrate at selected times while the printhead assembly scans over the substrate. The times at which to eject the droplets are selected so as to cause the droplets to land on the color elements at respective locations, such that respective locations are displaced from the center lines.

Inkjet printing of color filters

A system and method for selectable area laser treatment of a substrate, such as thin film transistors, the system including a holder holding a substrate in proximity to reactant, and laser beams each addressing independently selectable mutually set apart locations on the substrate to induce a reaction between the substrate and the reactant.

Selectable area laser assisted processing of substrates

A dynamic beam splitter including a beam deflector having a plurality of operative regions, the beam deflector being operative to receive a laser beam at a first one of the plurality of operative regions, the laser beam passing through the beam deflector, and to selectably direct the laser beam in response to a control input signal to pass through the beam deflector a second time. Methods for splitting a beam and for manufacturing an electrical circuit employing the dynamic beam splitter are also enclosed.

Dynamic beam splitter outputting a selectable number of beams

Growing community of inventors

Ramat Aviv, Israel

Abraham Gross