Fairchild Semiconductor Corporation

Anadigics, Inc.

Abid Hussain

Daniel Donoghue

Eric Gray

Gary Hau

Valter Karavanic

Duncan Little

An RF coupler implementable as an integrated circuit includes a first transmission line having a first line portion and a second line portion. A first end of the first transmission line is coupled to an input port for receiving an RF input signal. A second end of the first transmission line is coupled to an output port for providing an RF output signal. The RF coupler further includes a second transmission line formed between the first line portion and the second line portion such that magnetic field produced due to the RF input signal in the first line portion and the second line portion envelops the second transmission line. A first end of the second transmission line is configured as a coupled port for providing a coupled RF signal, and a second end of the second transmission line is coupled to a termination element to form an isolation port.

Radio frequency (RF) couplers

A coupler includes a substrate and a stack of first and second dielectric layers extending over a top surface of the substrate. The first dielectric layer comprises different dielectric material than the second dielectric layer. Two conductive lines extend over the stack of first and second dielectric layers, and are formed in the same plane parallel to a surface of the substrate.

High directivity ultra-compact coupler

A multi-mode RF amplifier is disclosed having high and low output power modes and two power paths. A first RF amplifier delivers power to both paths. When the multi-mode RF amplifier is biased into the high power, HP, mode, substantial power is delivered via both (first and second) paths. While in the low power, LP, mode, an RF switch is turned off, creating a high input impedance, open circuit for the first path, and effectively isolating the two paths. Therefore, power is delivered by the first RF amplifier to the second path only. The impedance presented to the output of the first RF amplifier is equal to the input impedance of the second path which may be optimally set for maximizing power added efficiency or output power in LP mode. Note that, in a preferred embodiment, even in the HP mode more power is delivered to the second power path than to the first power path.

Multi-mode power amplifier with high efficiency under backoff operation

A system with an RFin terminal and an RFout terminal includes an output matching network. The system further includes a coupler having a thru arm connected between the output matching network and the RFout terminal, and a coupled arm connected to a detector circuit. The coupler further includes a stack of first and second dielectric materials having different dielectric constants. The stack of first and second dielectric materials extends over a top surface of a substrate. The thru arm and the coupled arm extend over the stack of first and second dielectric materials in the same plane parallel to a surface of the substrate.

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Methuen, MA, United States of America

Abid Hussain