Olin Corporation

Advanced Technology Interconnect Incorporated

Abid A Khan

Derek E Tyler

Deepak Mahulikar

Julius C Fister

Jacob Crane

Szuchain F Chen

Brian Mravic

James E Dore

Stanley Shapiro

David W Dickinson

Dale L Bender

Composite materials for electronic packages are disclosed. The composite materials comprise a core layer and first and second cladding layers. The core and cladding layer compositions and thicknesses are selected to maximize thermal and electrical conductivity and to minimize the coefficient of thermal expansion of the composite. The composite material may be employed to fashion the package base, the leadframe, a heat spreader or combinations thereof. In one embodiment, a portion of the first cladding layer is removed so that an electronic device may be mounted directly to a high thermal conductivity core.

Thermal performance package for integrated circuit chip

An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the diffusion of copper from the substrate into the coating layer and the consequential formation of a brittle tin/copper intermetallic, a barrier layer is interposed between the substrate and the coating layer. This barrier layer contains from 20% to 40%, by weight, of nickel and is preferably predominantly comprised of copper. In one embodiment, an intermetallic layer selected from the group (Cu--Ni).sub.3 Sn, (Cu--Ni).sub.6 Sn.sub.5, Cu.sub.3 Sn, Cu.sub.6 Sn.sub.5 is disposed between the barrier layer and the tin base coating layer.

Tin coated electrical connector

An electrical conductor has a copper base substrate coated with a tin base coating layer. To inhibit the diffusion of copper from the substrate into the coating layer and the consequential formation of a brittle tin/copper intermetallic, a barrier layer is interposed between the substrate and the coating layer. This barrier layer contains from 10% to 70%, by weight, of nickel and is preferably predominantly comprised of copper. In one embodiment, an intermetallic layer selected from the group (Cu--Ni).sub.3 Sn, (Cu--Ni).sub.6 Sn.sub.5, Cu.sub.3 Sn, Cu.sub.6 Sn.sub.5 is disposed between the barrier layer and the tin base coating layer.

A copper base alloy is disclosed which exhibits improved resistance to crack propagation during hot processing as well as good mechanical properties. The alloy comprises from about 4.0 to about 11.0% tin, from about 0.01 to about 0.3% phosphorus, from about 1.0 to about 5.0% of a material selected from the group consisting of iron and a mixture of iron and cobalt, up to about 0.4% chromium, balance essentially copper. The alloy of the present invention possesses a substantially non-dendritic grain structure in the cast condition which contributes to said resistance to crack propagation.

Copper base alloys possessing improved processability

A method for adding reactive elements to molten copper or copper base alloys is disclosed. This method prevents unwanted reactions and oxidation by adding the reactive elements to the molten metal in the form of a powder mixture placed within tubing which is compatible with said molten metal. This filled tubing is sealed and drawn down, if desired, to an appropriate size for rapid melting within said molten metal and consequent rapid dissolution of the reactive elements throughout the molten metal.

Growing community of inventors

Godfrey, IL, United States of America

Abid A Khan