Intel Corporation

Citrix Systems, Inc.

Abhishek Gupta

Daewoong Suh

Carl L Deppisch

Mukul P Renavikar

Yeluri Raghuram

Jinlin Wang

Sasmita Patra

Navaneetha Subramanian

Brad Drew

Tirupati Reddy Bonam

Srinivasa Rao Sanchula

Mike Boyd

A method may include receiving, by a first computing system, a first request from a first client device to download content. The method may further include receiving, by the first computing system from a second computing system, first information. The first information may be indicative of a first version of the content that the first client device is authorized to download and a source from which the first version of the content can be downloaded. The method may also include determining, by the first computing system and based at least in part on the first information, that the first version of the content is already present on the first computing system. The method may additionally include sending, from the first computing system to the first client device, the first version of the content or second information, the second information indicative of the first version of the content.

Content caching

Systems, apparatuses and methods may provide for establishing a hardware-based chain of trust in a computing system and extending the hardware-based chain of trust to a container manager and a containerized application on the computing system. Additionally, the containerized application may be checked for its trust and security while it is launched, via the container manager, on the computing system. In one example, extending the hardware-based chain of trust includes conducting a pre-boot measurement of the container manager, a root of trust measurement agent, and one or more packages associated with the containerized application, and verifying the pre-boot measurement of the platform/host and the application itself prior to the containerized application being launched.

Trusted deployment of application containers in cloud data centers

In one embodiment, the present invention includes a method for placing a thermal interface material (TIM) between a die including a backside metallic (BSM) layer including copper (Cu) and a heat spreader having a contact surface including Cu, where the TIM is formed of an alloy including indium (In) and tin (Sn), and bonding the TIM to the die and the heat spreader to form at least one quaternary intermetallic compound (IMC) layer. Other embodiments are described and claimed.

Forming a semiconductor package including a thermal interface material

Methods and associated structures of forming an indium containing solder material directly on an active region of a copper IHS is enabled. A copper indium containing solder intermetallic is formed on the active region of the IHS. The solder intermetallic improves the solder-TIM integration process for microelectronic packaging applications.

Methods of fabricating robust integrated heat spreader designs and structures formed thereby

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Chandler, AZ, United States of America

Abhishek Gupta