Apple Inc.

Maxim Integrated Products, Inc.

Abhishek Choudhury

Matthew D Hill

Benjamin J Pope

Sawyer Isaac Cohen

Lucy Elizabeth Browning

Eric N Nyland

Ihtesham H Chowdhury

Tiao Zhou

Devon A Monaco

Sherry Lee

Arun R Varma

Bryan D Keen

Nicholas W Ruhter

James W Bilanski

David A Karol

Sean M Gordoni

Daniel J Morizio

Yaodong Wang

Ricky Agrawal

A portable electronic device includes a housing defining an internal volume and a circuit board assembly within the internal volume. The circuit board assembly includes a first circuit board, a wall structure soldered to the first circuit board, and a second circuit board soldered to the wall structure and supported above the first circuit board by the wall structure. The second circuit board defines an exterior top surface of the circuit board assembly. A processor is coupled to the first circuit board and positioned within an internal volume defined between the first circuit board and the second circuit board and at least partially surrounded by the wall structure. A memory module is coupled to the exterior top surface of the circuit board assembly.

Handheld electronic device

A device and fabrication techniques are described that employ wafer-level packaging techniques for fabricating semiconductor devices that include a pad defined contact. In implementations, the wafer-level package device that employs the techniques of the present disclosure includes a substrate, a passivation layer, a top metal contact pad, a thin film with a via formed therein, a redistribution layer structure configured to contact the top metal contact pad, and a dielectric layer on the thin film and the redistribution layer structure. In implementations, a process for fabricating the wafer-level package device that employs the techniques of the present disclosure includes processing a substrate, forming a passivation layer, depositing a top metal contact pad, forming a thin film with a via formed therein, forming a redistribution layer structure in the via formed in the thin film, and forming a dielectric layer on the thin film and the redistribution layer structure.

Pad defined contact for wafer level package

Growing community of inventors

San Jose, CA, United States of America

Abhishek Choudhury