Actus Potentia, Inc.

Other

Iowa State University Research Foundation, Inc.

Abhijit Chandra

Ambar K Mitra

Ashraf F Bastawros

Charles A Lemaire

Sutee Eamkajornsiri

Tom I-Ping Shih

Muthukkumar Kadavasal

Charles A Lamaire

Craig D Herreman

Joel P Dunham

Focused Electric Field Imprinting (FEFI) provides a focused electric field to guide an unplating operation and/or a plating operation to form very fine-pitched metal patterns on a substrate. The process is a variation of the electrochemical unplating process, wherein the process is modified for imprinting range of patterns of around 2000 microns to 20 microns or less in width, and from about 0.1 microns or less to 10 microns or more in depth. Some embodiments curve a proton-exchange membrane whose shape is varied using suction on a backing fluid through a support mask. Other embodiments use a curved electrode. Mask-membrane interaction parameters and process settings vary the feature size, which can generate sub-100-nm features. The feature-generation process is parallelized, and a stepped sequence of such FEFI operations, can generate sub-100-nm lines with sub-100-nm spacing. The described FEFI process is implemented on copper substrate, and also works well on other conductors.

Method for focused electric-field imprinting for micron and sub-micron patterns on wavy or planar surfaces

Apparatus for focused electric-field imprinting for micron and sub-micron patterns on wavy or planar surfaces

A method and apparatus for generating power which includes a phase-change media (PCM) that expands upon cooling contained within an expandable capsule if the phase change involves solidification (if phase change is solid-solid, then capsules are not needed), a carrier liquid that does not freeze in the operating temperature range, a heat exchanger, and an engine. Alternatively, the method and apparatus can include a PCM contained within a layer next to the walls of a constant volume container, a working liquid within the container that does not freeze in the operating temperature range, a heat exchanger, and an engine. In both cases, the engine denotes a device that converts the energy in the high-pressure liquid into electrical or mechanical power.

Method and apparatus for energy harvesting through phase-change induced pressure rise under cooling conditions

The present invention provides a computer-implemented method of problem solving that includes graphically displaying a plurality of concepts, dynamic links between the concepts, and solving a problem based on the displayed concepts and dynamic links. Other embodiments include: a computer-readable medium having instructions thereon for causing a suitably programmed information-processing apparatus to perform a method of the problem solving that includes graphically displaying a plurality of concepts, displaying dynamic links between the concepts, and solving a problem based on the displayed concepts and dynamic links. Still other embodiments include a computerized apparatus that includes a display output unit, a display drive unit that causes a plurality of concepts to be displayed on the display unit, and that causes dynamic links between the concepts to be displayed, and a solution unit that solves a problem based on the displayed concepts and dynamic links, and that displays the solution.

System and method for problem solving through dynamic/interactive concept-mapping

A Focused Electric Field Imprinting (FEFI) process and apparatus provides a focused electric field to guide an unplating operation and/or a plating operation to form very fine-pitched metal patterns on a substrate. The process is a variation of the electrochemical unplating process, wherein the process is modified for imprinting range of patterns of around 2000 microns to 20 microns or less in width, and from about 0.1 microns or less to 10 microns or more in depth. Some embodiments curve a proton-exchange membrane whose shape is varied using suction on a backing fluid through a support mask. Other embodiments use a curved electrode. Mask-membrane interaction parameters and process settings vary the feature size, which can generate sub-100-nm features. The feature-generation process is parallelized, and a stepped sequence of such FEFI operations, can generate sub-100 nm lines with sub-100 nm spacing. The described FEFI process is implemented on copper substrate, and also works well on other conductors.

A method for control of chemical mechanical polishing of a pattern dependant non-uniform wafer surfaces in a die scale wherein the die in the wafer surface have a plurality of zones of different heights and different pattern densities is provided. The method provides for varying pressure applied to the die both spatially and temporally to reduce both local and global step height variations. In one embodiment, pressure is varied both spatially and temporally using a look ahead algorithm. The algorithm looks ahead and recalculates/modifies the pressure values by identifying the step heights that could be formed after a specified time step. The final surface predictions have improved uniformity on the upper surface as well as on the step heights across the entire die.

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Ames, IA, United States of America

Abhijit Chandra