Apple Inc.

Ques Tek Innovations, LLC

Abhijeet Misra

James A Wright

William A Counts

James A Yurko

Herng-Jeng Jou

Eric W Hamann

Hoishun Li

Brian M Gable

Lei Gao

Charles J Kuehmann

Weiming Huang

Stephen Brian Lynch

Michael Benjamin Wittenberg

Matthew D Hill

Christopher S Graham

Ian A Spraggs

Lee E Hooton

Marwan Rammah

James A Curran

Guangtao Zhang

Raymund W M Kwok

Steven J Osborne

Anthony D Prescenzi

Christopher D Prest

John C Difonzo

Brian S Tryon

Karl Ruben F Larsson

Todd S Mintz

Jason T Sebastian

Jiadong Gong

Isabel Yang

Adam Thomas Clavelle

John C DiFonzo

Richard Hung Dinh

Alexander W Williams

Daniel T McDonald

Zechariah D Feinberg

Nagarajan Kalyanasundaram

Jeffrey Lee Mattlin

David R Snyder

Shi Hua Zhang

Yu Yan

Brian P Demers

Katie L Sassaman

Jeremy Hoishun Li

Rafael Yu

William Arthur Counts

Anuj Datta Roy

Dana J Frankel

Susannah P Calvin

Jennifer D Schuler

Andrew W Meschke

Chuan Liu

Graeme W Paul

Daniel T Mcdonald

Jason Sebastian

A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

Additively manufactured device enclosures

A housing for an electronic device can include an exterior titanium portion, an interior metal joined to the exterior titanium portion, the interior metal being a different metal than the exterior titanium portion, and an intermetallic compound having a thickness of less than 1 μm disposed between the interior metal and the exterior titanium portion.

Electronic device including clad components

A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

Core shell with various filler materials for enhanced thermal conductivity

A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.

Direct metal deposition of electronic device components

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Electronic device having a composite structure

The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

Recycled aluminum alloys from manufacturing scrap with cosmetic appeal

A mold apparatus to form a ceramic (or glass) includes a first mold portion having a first coefficient of thermal expansion and a second mold portion having a second coefficient of thermal expansion. In some embodiments, the first mold portion and/or the second mold portion are substantially immiscible with the ceramic material, such as silicon oxide, at a temperature greater than 600&#xb0; C. In some embodiments, the first coefficient of thermal expansion and the second coefficient of thermal expansion are substantially similar to that of the glass or ceramic material. In some embodiments, the first coefficient of thermal expansion is different from the second coefficient of thermal expansion. In some embodiments, the first mold portion and the second mold portion contain a surface coating and a passivation layer.

Mold materials for formed ceramic

This application relates to a composite part that can include a non-metal layer having attachment features, and a metal part that is joined with the non-metal layer. The metal part can include a plurality of interlocking structures that are disposed at an external surface of the metal part, where each of the interlocking structures can include an opening characterized as having a first width, and an undercut region, where the opening leads into the undercut region, and the undercut region is characterized as having a second width that is greater than the first width such that the undercut region captures and retains one of the attachment features of the non-metal layer.

Etching for bonding polymer material to a metal surface

A component for an electronic device can include a metal alloy formed by a metal injection molding process. The metal alloy can have a composition of about 32 wt % to about 38 wt % cobalt and about 62 wt % to about 68 wt % iron.

Soft magnetic alloy optimized for metal injection molding

This application relates to an enclosure for a portable electronic device is described. The enclosure can include metal bands included along the enclosure and a support structure. The support structure can include a thermally conductive core that is capable of conducting thermal energy generated by the operational components and rails that are bound between the metal bands and the thermally conductive core, where the rails are characterized as having a rate of thermal conductivity that is less than a rate of thermal conductivity of the thermally conductive core so that the thermal energy generated by the operational component is directed away from the operational component and away from the metal bands.

Cladded metal structures for dissipation of heat in a portable electronic device

A beryllium-free high-strength copper alloy includes, about 10-30 vol % of L1-(Ni,Cu)(Al,Sn), and substantially excludes cellular discontinuous precipitation around grain boundaries. The alloy may include at least one component selected from the group consisting of: Ag, Cr, Mn, Nb, Ti, and V, and the balance Cu.

Beryllium-free high-strength copper alloys

Alloys, processes for preparing the alloys, and articles including the alloys are provided. The alloys can include, by weight, about 0.01% to about 1% vanadium, 0% to about 0.04% carbon, 0% to about 8% niobium, 0% to about 1% titanium, 0% to about 0.04% boron, 0% to about 1% tungsten, 0% to about 1% tantalum, 0% to about 1% hafnium, and 0% to about 1% ruthenium, the balance essentially molybdenum and incidental elements and impurities.

Ductile high-temperature molybdenum-based alloys

The disclosure provides aluminum alloys having varying ranges of alloying elements and properties. The aluminum alloys have a wt % ratio of Zn to Mg from 2.5 to 3.5.

Aluminum alloys with high strength and cosmetic appeal

An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.

Enclosure with metal interior surface layer

An alloy includes, in weight percentage, about 20.0% to about 25.0% chromium, 0% to about 5.0% molybdenum, about 3.0% to about 15.0% cobalt, about 1.5% to about 6.0% niobium, about 1.0% to about 3.0% tantalum, about 1.0% to about 5.0% tungsten, 0% to about 1.0% aluminum, 0% to about 0.05% carbon, 0% to about 0.01% titanium, and the balance nickel and incidental elements and impurities, wherein the alloy includes L1and D0precipitates in a compact morphology.

Nickel-based alloys

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Sunnyvale, CA, United States of America

Abhijeet Misra