Active Layer Parametrics, Inc.

University of California

Abhijeet Joshi

Bulent Mehmet Basol

Jalal Ashjaee

Jere C Harrison

In some embodiments, a method includes forming a mini chamber over a test region, the mini chamber comprising an inlet, an outlet and an electrode, introducing an electrolyte solution into the mini chamber through the inlet, applying an electro-etching potential difference between the electrode and at least one contact region and reducing the thickness of a semiconductor film portion at the test region forming a thinned down semiconductor film portion, replacing the electrolyte solution in the mini chamber with a fluid that is substantially insulating, and determining the electrical property of the thinned down semiconductor film portion while the fluid is in the mini chamber.

Methods and tools for electrical property depth profiling using electro-etching

A method for electrically characterizing a layer disposed on a substrate and electrically insulated from the substrate is disclosed. The method can include forming a test pattern, contacting the test pattern with electrical contact elements at contact regions, and measuring an electrical parameter of the layer by passing a first set of test currents between contact regions. The test pattern can be formed by pushing a pattern forming head against a top surface of the layer, introducing a first fluid into the cavity, and converting the sacrificial portion of the layer into an insulator using the first fluid and forming the test pattern under the test-pattern-shaped inner seal.

Methods and apparatus for test pattern forming and film property measurement

Methods, tools and systems for full characterization of thin and ultra-thin layers employed in advanced semiconductor device structures are disclosed.

Methods and systems for material property profiling of thin films

Various embodiments of undulators, methods of fabricating undulators, and systems incorporating undulators are described. Certain embodiments provide a compact, electromagnetic undulator. The undulator may comprise a substrate and one or more electromagnets, which may be formed on the substrate. Certain embodiments have a period not greater than about 5 mm. The undulator may be operatively coupled with a particle accelerator to provide a free electron laser system.

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Los Angeles, CA, United States of America

Abhijeet Joshi