Intel Corporation

Abhay A Watwe

Gregory Martin Chrysler

Kramadhati V Ravi

Sairam Agraharam

Michael C Garner

Ravi S Prasher

Kristopher J Frutschy

Ajit V Sathe

Leo Ofman

Processes are described whereby a wafer is manufactured, a die from the wafer, and an electronic assembly including the die. The die has a diamond layer which primarily serves to spread heat from hot spots of an integrated circuit in the die.

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal interface formed of diamond, a diamond composite, or graphite. In an embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Electronic assembly with high capacity thermal interface and methods of manufacture

Two types of thermal management devices for efficiently dissipating heat generated by high performance electronic devices, such as microprocessors for desktop and server computers producing a power of near 200 Watts and high power electronic devices that are small and thin, such as those used in telephones, radios, laptop computers, and handheld devices. An integrated heat sink and spreader for cooling an item has a vapor chamber heat sink with a thinner first wall and a thicker second wall. The thicker second wall is engageable with the item in efficient heat transferring relationship. A plurality of heat-radiating fins are attached to the thinner first wall. An embedded direct heat pipe attachment includes a heat pipe embedded in a spreader plate that is in direct heat transferring contact with an item through a thin, uniform layer of thermal interface material.

Integrated vapor chamber heat sink and spreader and an embedded direct heat pipe attachment

To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal interface formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Electronic assembly with high capacity thermal interface

A method and apparatus for cooling a heat source in an electronic device is provided. The apparatus includes a vapor chamber with a heat source at a first end. A heat sink can be provided at a second end of the vapor chamber. The vapor chamber absorbs the heat generated by the heat source. The heat is then transferred via the vapor chamber to a plurality of fins attached to the vapor chamber. If a heat sink is provided, the heat is also transferred via the vapor chamber to the heat sink. The heat sink can also include a plurality of fins. The fins and the heat sink then convectively dissipate the heat to the atmosphere.

Growing community of inventors

Chandler, AZ, United States of America

Abhay A Watwe