California Institute of Technology

United States of America As Represented by the Administrator of Nasa

Abdur R Khan

Larry W Epp

Daniel J Hoppe

Hugh K Smith

R Peter Smith

Daniel Kelley

A radial power combiner/divider capable of a higher order (for example, N=24) of power combining/dividing and a 15% bandwidth (31 to 36 GHz). The radial power combiner/divider generally comprises an axially-oriented mode transducer coupled to a radial base. The mode transducer transduces circular TE01 waveguide into rectangular TE10 waveguide, and the unique radial base combines/divides a plurality of peripheral rectangular waveguide ports into a single circular TE01 waveguide end of the transducer. The radial base incorporates full-height waveguides that are stepped down to reduced-height waveguides to form a stepped-impedance configuration, thereby reducing the height of the waveguides inside the base and increasing the order N of combining/dividing. The reduced-height waveguides in the base converge radially to a matching post at the bottom center of the radial base which matches the reduced height rectangular waveguides into the circular waveguide that feeds the mode transducer.

Wideband radial power combiner/divider fed by a mode transducer

An energy transfer system is disclosed. The system includes patch elements, shielding layers, and energy rectifying circuits. The patch elements receive and couple radio frequency energy. The shielding layer includes at least one opening that allows radio frequency energy to pass through. The openings are formed and positioned to receive the radio frequency energy and to minimize any re-radiating back toward the source of energy. The energy rectifying circuit includes a circuit for rectifying the radio frequency energy into dc energy. A plurality of energy rectifying circuits is arranged in an array to provide a sum of dc energy generated by the energy rectifying circuit.

Rectenna for high-voltage applications

An aperture coupled patch splits energy from two different polarization components to different locations to spread heat. In addition, there is no physical electrical connection between the slot, patch and circuitry. The circuitry is located under a ground plane which shields against harmonic radiation back to the RF source.

Growing community of inventors

La Crescenta, CA, United States of America

Abdur R Khan