Meta Platforms, Inc.

Plessey Semiconductors Limited

Abdul Shakoor

Andrea Pinos

Jun-Youn Kim

Mohsin Aziz

Samir Mezouari

Kevin Stribley

Gary Charles Day

Ian Murray

James Walker Carswell

James Carswell

Anwer Saeed

According to the first aspect of the disclosure, a method of forming a light emitting device array precursor is provided. The method comprises forming a first light emitting layer on a first substrate, forming an array of first light emitting devices from the first light emitting layer, each first light emitting device configured to emit light having a first wavelength. A first bonding layer is formed on the first light emitting layer. A second light emitting layer is formed on a second substrate, the second light emitting layer configured to emit light having a second wavelength different to the first wavelength. A second bonding layer is formed on the second light emitting layer. The second bonding layer is bonded to a handling substrate, followed by removing the second substrate from the second light emitting layer. A third bonding layer is formed on the second light emitting layer on an opposite side of the second light emitting layer to the handling layer. The first bonding layer is bonded to the third bonding layer and the handling substrate is removed from the second light emitting layer. An array of second light emitting devices is formed from the second light emitting layer, the array of second light emitting devices aligned relative to the array of first light emitting devices such that they are spaced apart from each other in a plane parallel to each of the first and second light emitting layers.

Light emitting array

A micro-LED device and a method of fabricating the micro-LED device are disclosed. The method includes processing from a first side (e.g., p-side) of epitaxial layers of a micro-LED wafer to form individual mesa structures and a first solid metal bonding layer on the mesa structures, bonding a second solid metal bonding layer on a backplane wafer to the first solid metal bonding layer of the micro-LED wafer, removing the substrate of the micro-LED wafer and processing from a second side (e.g., n-side) of the epitaxial layers to isolate the solid metal bonding layers and form individual electrodes (e.g., anodes) for individual micro-LEDs, forming a dielectric material layer on surfaces in regions between the mesa structures, and depositing one or more metal materials in the regions between the mesa structures to form mesa sidewall reflectors and a common electrode for the micro-LEDs.

Small-pitch micro-LEDs

A micro-light emitting diode includes a substrate including at least a first portion of an n-type semiconductor layer, and a mesa structure on the substrate and characterized by a linear lateral dimension equal to or less than about 3 &#x3bc;m. The mesa structure includes a plurality of epitaxial layers, and a conductive distributed Bragg reflector (DBR) on the plurality of epitaxial layers. The conductive DBR includes a plurality of transparent conductive oxide layers and covers between about 80% and about 100% of a full lateral area of the plurality of epitaxial layers. The micro-LED also includes a dielectric layer on sidewalls of the mesa structure, a reflective metal layer on sidewalls of the dielectric layer and electrically coupled to the first portion of the n-type semiconductor layer, and a first metal electrode in direct contact with the conductive DBR.

Self-aligned ITO DBR based p-contact for small pitch micro-LED

A display device includes a plurality of light emitting diodes (LEDs) having walls that extend through a transparent semiconductor layer and beyond the surface of the transparent semiconductor layer. Each of the walls surrounds at least part of each of the plurality of LEDs to collimate the light emitted by the plurality of LEDs. In some embodiments, the walls collimate the light emitted by the LEDs by reflecting the light or absorbing a portion of the light. The display device may further include an array of optical lenses that faces the surface of the transparent semiconductor layer to further collimate the light emitted from the LEDs.

Collimation of light emitted by light emitting diodes using walls extending through transparent semiconductor

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Plymouth, United Kingdom

Abdul Shakoor