Infineon Technologies Ag

Abdul Rahman Mohamed

Ralf Otremba

Josef Hoeglauer

Xaver Schloegel

Adolf Koller

Juergen Schredl

Chooi Mei Chong

Manfred Kotek

Werner Kroeninger

Stanley Job Doraisamy

Ke Yan Tean

Tien Lai Tan

Mohd Kahar Bajuri

Subaramaniym Senivasan

Fong Lim

Koh Hoo Goh

Chu Hua Goh

Bun-Hin Keong

Zakaria Abdullah

Ida Fischbach

Siang Kuan Chua

A clip for a semiconductor package and a semiconductor having a clip is disclosed. In one example, the clip includes a first planar portion, a plurality of first pillars, and a plurality of first solder balls. Each first pillar of the plurality of first pillars is coupled to the first planar portion. Each first solder ball of the plurality of first solder balls is coupled to a corresponding first pillar of the plurality of first pillars.

Clips for semiconductor packages

A method of fabricating a semiconductor device is disclosed. In one aspect, the method includes placing a first semiconductor chip on a carrier with the first main surface of the first semiconductor chip facing the carrier. A first layer of soft solder material is provided between the first main surface and the carrier. Heat is applied during placing so that a temperature at the first layer of soft solder material is equal to or higher than a melting temperature of the first layer of soft solder material. A second layer of soft solder material is provided between the first contact area and the second main surface. Heat is applied during placing so that a temperature at the second layer of soft solder material is equal to or higher than a melting temperature of the second layer of soft solder material. The first and second layers of soft solder material are cooled to solidify the soft solder materials.

Semiconductor device fabricated by flux-free soldering

An adjustable pick-up head, a collet head, a method to adjust a pick-up head and a method of manufacturing a device are disclosed. In one embodiment a pick-up head includes a shank having a holder and an intermediate body connected to the holder by a first joint. The pick-up head further includes a collet head connected to the intermediate body by a second joint.

Adjustable pick-up head and method for manufacturing a device

A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the first main surface of the semiconductor chip facing the carrier. A first layer of solder material is provided between the first main surface and the carrier. A contact clip including a first contact area is placed on the semiconductor chip with the first contact area facing the second main surface of the semiconductor chip. A second layer of solder material is provided between the first contact area and the second main surface. Thereafter, heat is applied to the first and second layers of solder material to form diffusion solder bonds between the carrier, the semiconductor chip and the contact clip.

Semiconductor device using diffusion soldering

An electronic device and method of manufacturing. One embodiment includes attaching a first semiconductor chip to a first metallic clip. The first semiconductor chip is placed over a leadframe after the attachment of the first semiconductor chip to the first metallic clip.

Method of manufacturing electronic device on leadframe

A method of fabricating a semiconductor chip includes the providing an adhesive layer on the outer area of the active surface of a device wafer and attaching a rigid body to the active surface by the adhesive layer. The device wafer is thinned by treating the passive surface of the device wafer. A first backing tape is connected to the passive surface of the device wafer. The outer portion of the rigid body is separated from the central portion of the rigid body and the outer portion of the device wafer is separated from the central portion of the device wafer. The central portion of the rigid body, the outer portion of the device wafer and the outer portion of the rigid body are removed from the first backing tape. The device wafer may be diced into semiconductor chips.

Method of producing a thin semiconductor chip

A semiconductor package () comprises a semiconductor die () with a plurality of contact areas () on its active surface and an electrically conductive bump () on each contact area (). The die () and electrically conductive bumps () are encapsulated in a plastic housing () so that the plastic housing () encapsulates at least sides of the die () and sides of the electrically conductive bumps ().

Chip-sized flip-chip semiconductor package and method for making the same

Growing community of inventors

Johor, Malaysia

Abdul Rahman Mohamed