Xerox Corporation

Abdul M ElHatem

William H Wayman

Tuan Anh Vo

Mohammad M Mojarradi

Mostafa R Yazdy

Lamar T Baker

Jaime Lerma

Paul C Tien

Eric Peeters

Scott Alan Elrod

Joel A Kubby

Dan A Hays

Babur B Hadimioglu

Steven A Buhler

Jaan Noolandi

Kaiser H Wong

Hung C Nguyen

Masaji Sato

A high power MOSFET semiconductor having a high breakdown voltage. The new power device concept that reaches an area of a lower specific on-resistance, higher breakdown voltage and reduced device silicon area. This device architecture is built on the concepts of charge compensation in the drift region of the device. Where, the doping of the vertical drift region is increased by one order of magnitude. To counterbalance the added charges, fine-structured wells of opposite doping type to the drift region are introduced as part of the device structure. The charge compensation wells do not contribute to the on-state current conduction, therefore, this novel new generation of high voltage device architecture breaks the limit line of silicon. This architecture may extend to higher material resistivity and larger geometry to increase the voltage to 1kv plus.

High power mosfet semiconductor device

Described are various compensation circuit designs to ensure proper shutoff of an unselected transducer in a transducer switching matrix. The switch of an unselected transducer is moved to a strong OFF state by injection of a compensation current. The compensation network is implemented as semiconductor integrated circuits which provide a high-voltage column switching diode, and a compensation switch. The compensation switch and column switching diode are configured such that they are isolated from each other.

Printhead array compensation device designs

An acoustic inkjet printhead utilizes a pulse width modulation to control droplet size or ejection velocity. An individual control pulse controls the duration and the time a RF signal is applied to each transducer. To modify the RF signal of each transducer, the pulse width of each control signal can be modified according to a predetermined correction data. The rising edge of the control data is delayed according to the correction data while the falling edge is kept the same.

Pulse width modulation for correcting non-uniformity of acoustic inkjet printhead

A device for the transport of particulate marking material includes a plurality of interdigitated electrodes formed on a substrate. An electrostatic traveling wave may be generated across the electrodes to sequentially attract particles of marking material, and thereby transport them to a desired location. The electrodes may be integrally formed with driving circuitry, and may be staggered to minimize or eliminate cross-talk.

Particulate marking material transport apparatus utilizing traveling electrostatic waves

A compact design for the electronic circuits to provide electrical contact to a SED roll of a segmented electrode development unit is provided. In this invention, the required high voltage and low voltage circuitry is placed on a printed flexible circuit which is folded and rolled into a cylindrical circuit to be connected to the SED roll. The flexible printed circuit has a plurality of output terminals each of which will be connected to one of the electrodes of the SED roll and a plurality of input terminals each of which will be connected to a terminal of a slip ring to receive the required electrical power.

Connection between a compact electrical circuit and a segmented

A compact design for the electronic circuits to provide electrical contact to a SED roll of a segmented electrode development unit is provided. In this invention, all the required high voltage and low voltage circuitry is placed on a printed flexible circuit which is folded and rolled into a cylindrical circuit to be connected to the SED roll. The flexible printed circuit has a plurality of output terminals each of which will be connected to one of the electrodes of the SED roll.

Compact design for combination of an electrical circuit with a segmented

There is disclosed a compact design for the electronic circuits required to provide electrical contact to a SED roll of a segmented electrode development unit. In this invention, all the required high voltage and low voltage circuitry is placed on a printed flexible circuit which is folded and rolled into a cylindrical circuit to be connected to the SED roll. The flexible printed circuit has a plurality of output terminals each of which will be connected to one of the electrodes of the SED roll. In this invention, a spool is used to support the connection of the cylindrical circuit to the SED roll.

An inkjet printhead addressing and firing design which minimizes voltage drop differential occurring on a power bus which supplies power to fire individual ink jets due to current loads needed to fire the individual ink jets. The voltage drop differential can be reduced in part by firing a group of individual jets which are spaced out over the entire length of the array instead of firing a group of adjacent jets. Spacing of the firing jets will insure that less than an entire amount of current needed to fire a group of jets will be needed in the center of the bus. Reducing the amount of current needed to travel the length of the bus reduces the voltage drop differential on the bus caused by current conduction along the bus.

Thermal ink jet printhead with reduced power bus voltage drop

A method in which several high voltage chips may be packaged within a single, typically low voltage plastic package. The high voltage chips are packaged to remain electrically isolated from each other to avoid undesirable side effects such as arcing between the chips but able to share electronic data and communicate with each other electronically through their input and ouput nodes. Due to the unique packaging method, the typically low voltage plastic packaging can be made to withstand operating voltages up to 35 times greater than previously attained by such low voltage plastic packaging.

Method of packaging a high voltage device array in a multi-chip module

An electronic circuit package in which several high voltage components are packaged along with low voltage components using standard circuit boards and minimizing the space needed for the entire assembly. A miniature circuit board, constructed of standard circuit board material, is used to mount several electronic components, some of which require high voltages. To meet isolation requirements, requiring a dielectric strength more than that provided by the board itself, between the high and low voltage nodes the circuit board incorporates slots or other cut out shapes in the board. The slots or other cut out shapes provide two functions. The first use for the slots or other cut out shapes is to prevent charge migration on the surface of the board between high and low voltage nodes. This is accomplished by placing the slots or other cut out shapes between high and low voltage nodes. The circuit board is then encapsulated within a potting material. The slots or other cut out shapes perform a second function of allowing the potting material to flow around and through the board to facilitate full encapsulation of the board and the electronic devices on the board. Several of the slots or other cut out shapes are placed in the board directly underneath the electronic devices mounted on the board to aid in allowing the potting material to completely surround and encapsulate the electronic devices.

Method of packaging high voltage components with low voltage components

An improved optically controlled power supply regulator in which an optoisolator transistor is controlled by an input light emitting diode replaces an optically controlled power supply regulator with a light emitting diode controlled with a light dependent resistor. The optically controlled power supply regulator utilizes a capacitor and a resistor to reduce loop response oscillation in order to prevent the optically controlled power supply regulator from being shut down on a system board.

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Redondo Beach, CA, United States of America

Abdul M ElHatem