Em Microelectronic-marin Sa

Em Microelectric-mann S.a.

Abdul-Hamid Kayal

André Grandjean

Victorio Quercia

Michel Willemin

Steve Tanner

Jean-Claude Rais

Eric Lugt

Authentication and secure wireless data exchange is provided between a chip with an identification code and a dedicated server via a read unit, which carries out contactless read and/or write operations on the chip. The read unit connects to a computer terminal connected to a communication network. A first connection is first established to the communication network from the computer terminal connected to the read unit to the dedicated server using a defined secure data communication protocol. A second connection to the communication network from the read unit to the dedicated server is then established using the computer terminal as a secure data transmission tunnel to directly exchange encrypted data between the read unit and the server invisibly to the computer terminal. Finally, wireless personalized communication is carried out between the read unit and the chip once the chip is identified upon request of the dedicated server.

Method of authentication and secure exchange of data between a personalised chip and a dedicated server, and assembly for implementing the same

The optoelectronic module includes a photoreceptor circuit for picking up light from a light source by reflection on an external surface. The photoreceptor circuit and the light source circuit are mounted on a substrate, and contact pads of the circuits are electrically connected to pads of the substrate. The substrate pads are connected to conductive paths of the substrate. The flexible substrate includes a first portion on which the photoreceptor circuit and light source circuit are mounted and electrically connected, a second portion including electrical connection terminals and a connecting portion between the first portion and the second portion. This connecting portion connects some conductive paths of the first portion to the connection terminals of the second portion. The connecting portion allows the height and/or spacing of the second portion to be adjusted relative to the first portion when the module is mounted, particularly in a computer mouse.

Optoelectronic module provided with a flexible substrate and at least one photoreceptor circuit incorporated into a computer mouse

The optoelectronic circuit includes a photoreceptor () made in a silicon semiconductor substrate (), and a monomode VCSEL laser diode () made in a gallium arsenide substrate. The photoreceptor includes at least one photosensitive area with a pixel array for picking up light and an area with a control and processing unit for the signals supplied by the pixels. The laser diode is mounted and electrically connected directly on one part of the photoreceptor. The laser diode is connected by a conductive terminal () to a first contact pad () at the bottom of a cavity () made through a passivation layer () of the photoreceptor. An electrode () on the top of the diode is connected by a metal wire () to a second contact pad () of the photoreceptor. The photoreceptor controls the diode directly via the electrode and the conductive terminal to generate a laser beam (L).

Optoelectronic circuit with a photoreceptor and a laser diode, and module comprising the same

The method of making an optoelectronic module (), which includes a first light source circuit () and a second photoreceptor circuit () for picking up light from the first light source circuit reflected on an external surface. A first moulding () with an encapsulation material is made on one part of a lead frame () having several conductive paths () and an external frame () connecting all of the conductive paths. A first light source circuit () is placed on one portion of a first conductive path () of the lead frame that is not covered by the first moulding. A second photoreceptor circuit () is placed on one portion of a second conductive path () of the lead frame not covered by the first moulding. A through opening () is also made in the first moulding () between the external frame () and the location of the first light source circuit () to give access to the first connecting path () and to a third connecting path () for the first light source circuit. The contact pads of the first and second circuits () are connected by metal wires () to corresponding uncovered pads of certain connecting paths () of the lead frame (). The first and third connecting paths () are then cut through the through opening () of the first moulding () in order to insulate electrically the first light source circuit () from the external parts. The light source circuit is thus protected from any electrostatic discharge. A second moulding can then be made on the first moulding () in order to close the through opening and obtain first and second apertures on the first and second circuits () for the passage of light.

Method of making an optoelectronic module and optoelectronic module obtained by such method

The integrated photoreceptor circuit includes a photosensitive area for picking up light and a processing unit area for processing the signals provided by the photosensitive area. This photoreceptor circuit includes electric contact pads, which are arranged symmetrically solely on the side of the processing unit area, which is juxtaposed with the photosensitive area. The integrated photoreceptor circuit is mounted on a first portion of a flexible substrate. The contact pads of the integrated photoreceptor circuit are electrically connected to electrical connection pads of the printed circuit of the flexible substrate. A second portion of the flexible substrate carries electrical connection terminals, which are connected to the connection pads via conductive paths, arranged in part on a connecting portion between the first and second portions. A through aperture in the first portion may be provided opposite the photosensitive area only of the photoreceptor circuit.

Integrated photoreceptor circuit and optoelectronic component including the same with electric contact pads arranged solely on side of the processing area which is juxtaposed with the photosensitive area

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Neuchâtel, Switzerland

Abdul-Hamid Kayal