Ciba-geigy Corporation

Abdul-Cader Zahir

Alfred Renner

Siegfried Wyler

George E Green

Hans Lehmann

Andreas Kramer

Sameer H Eldin

Rolf Schmid

Werner Stauffer

Ewald Losert

Hermann Diethelm

Imre Forgo

Jacques Francois

Rudolf Brunner

Karl Mechera

Heinz Remabold

Sigfried Wyler

Hardenable compositions

Storage-stable heat-curable mixtures are described which contain

Mixtures containing polymides alkenyphenols and either epoxide

Compounds of formula I or II ##STR1## wherein R.sup.1 and R.sup.2 are hydrogen, alkyl, cyclohexyl, phenyl, benzyl or tolyl, or are a --CH.sub.2 --CHR.sup.3 --CH.sub.2 --S--CO--R.sup.4 radical, R.sup.3 is hydrogen or methyl, R.sup.4 is alkyl, cyclohexyl, phenyl, benzyl or tolyl, X is alkylene, --S--, --SO--, --SO.sub.2 -- or substituted alkylene, in which R.sup.5 and R.sup.6 are hydrogen or alkyl, and n is an integer from 1 to 10, can be used as latent hardeners for epoxy resins. The compositions containing epoxy resins and these hardeners are particularly suitable for use as single component adhesive formulations. The cured products have good hot water resistance.

(Acylthiopropyl)phenols

Compounds of formula I or II ##STR1## in which formulae R.sup.1 and R.sup.2 are each independently of the other hydrogen, alkyl, alkenylmethyl, cyclohexyl, phenyl, benzyl or tolyl, or are a --CH.sub.2 --CHR.sup.3 --CH.sub.2 --S--H group, R.sup.3 and R.sup.4 are each independently of the other hydrogen or methyl, X is alkylene, --S--, --SO--, --SO.sub.2 -- or substituted alkylene, R.sup.5 and R.sup.6 are each independently of the other hydrogen or alkyl, R.sup.8 is hydrogen, alkyl, alkenylmethyl or phenyl, and wherein n is an integer from 1 to 10, can be used as hardeners for epoxy resins. The compositions containing epoxy resins and these hardeners are particularly suitable for use as adhesive formulations. The cured products have good moisture resistance.

Compositions comprising an epoxy resin and mercaptan-containing

Compounds of formula I or II ##STR1## wherein R.sup.1 and R.sup.2 are hydrogen, alkyl, cyclohexyl, phenyl, benzyl or tolyl, or are a --CH.sub.2 --CHR.sup.3 --CH.sub.2 --S--CO--R.sup.4 radical, R.sup.3 is hydrogen or methyl, R.varies.is alkyl, cyclohexyl, phenyl, benzyl or tolyl, X is alkylene, --S--, --SO--, --SO.sub.2 -- or substituted alkylene, in which R.sup.5 and R.sup.6 are hydrogen or alkyl, and n is an integer from 1 to 10, can be used as latent hardeners for epoxy resins. The compositions containing epoxy resins and these hardeners are particularly suitable for use as single component adhesive formulations. The cured products have good hot water resistance.

Triglycidyl compounds of the formula I ##STR1## and epoxy resin mixtures containing a triglycidyl compound of the formula I and a tetraglycidyl compound of the formula II ##STR2## in which formulae each of R and R' independently is a hydrogen atom, C.sub.1 -C.sub.6 alkyl, phenyl, cyclohexyl or cyclopentyl, and each of R.sub.1, R.sub.2, R.sub.3 and R.sub.4 independently is a hydrogen atom, a halogen atom, or C.sub.1 -C.sub.6 alkyl. Thses compounds are valuable epoxy resins which are also suitable for the preparation of B-stage resins.

Triglycidyl compounds of aminophenols

A mixture consisting of a polymaleimide and a copolymerizable monomer or a prepolymer formed from these two compounds contains, as the polymerization catalyst, an ethane which is substituted by aromatic groups and hydroxyl groups or halogen (cf. formula II), such as benzpinacol. The mixture is stable on storage and heat-curable. It can be cured, while at the same time being shaped to give mouldings, sheet-like structures, laminates, adhesive bonds or foams, for example by casting or compression moulding.

Heat-curable mixtures, stable on storage, based on polyimides and

The invention relates to a polymerizable and self-crosslinkable composition of monomers having olefinic unsaturation and, if desired, conventional additives, said composition containing

Self-crosslinkable monomer composition containing alkenylphenyl

Curable mixtures based on maleimides and propenyl-substituted phenols,

Hydroxyl-containing compositions and their polymerization

Curable mixtures based on maleimides and 1-propenyl-substituted phenols

The adhesive or adhesive component according to the invention, which contains a vinyl monomer, a vinyl polymer, a compound producing free radicals, and, as an adhesion promoter, an acid amide or imide which is substituted on the nitrogen atom by a chlorosulfonated alkyl, aryl or aralkyl group, forms, together with an amine accelerator, an adhesive with which heat-, oil- and water-resistant bonds, for example of metals, polymeric materials, glass and ceramics, having very high tensile shearing strength can be obtained. The adhesive can also be converted into the form of a dried sheet, with or without carrier, and in this form can be used for bonding.

Adhesive or adhesive component containing chlorosulfonated amide or imide

Mixtures which can be cured to give moulded materials having technically very valuable mechanical and dielectric properties, characterised in that they contain

Curable mixtures based on maleimide and

Epoxide-containing compositions and their polymerization

Mixtures which can be cured to give moulded materials having technically very valuable mechanical and dielectric properties, characterized in that they contain

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Oberwil, Switzerland

Abdul-Cader Zahir