Motorola Corporation

Abbas Guvenilir

Suresh Venkatesan

Janos Farkas

Venkat Kolagunta

Mohammed Rabiul Islam

Rajesh Tiwari

Brian George Anthony

John Mendonca

A copper interconnect polishing process begins by polishing ( ) a bulk thickness of copper ( ) using a first platen. A second platen is then used to remove ( ) a thin remaining interfacial copper layer to expose a barrier film ( ). Computer control ( ) monitors polish times of the first and second platen and adjusts these times to improve wafer throughput. One or more platens and/or the wafer is rinsed ( ) between the interfacial copper polish and the barrier polish to reduce slurry cross contamination. A third platen and slurry is then used to polish away exposed portions of the barrier ( ) to complete polishing of the copper interconnect structure. A holding tank that contains anti-corrosive fluid is used to queue the wafers until subsequent scrubbing operations ( ). A scrubbing operation ( ) that is substantially void of light is used to reduce photovoltaic induced corrosion of copper in the drying chamber of the scubber.

Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process

A copper interconnect polishing process begins by polishing (,) a bulk thickness of copper (,) using a first platen. A second platen is then used to remove (,) a thin remaining interfacial copper layer to expose a barrier film (,). Computer control (,) monitors polish times of the first and second platen and adjusts these times to improve wafer throughput. One or more platens and/or the wafer is rinsed (,) between the interfacial copper polish and the barrier polish to reduce slurry cross contamination. A third platen and slurry is then used to polish away exposed portions of the barrier (,) to complete polishing of the copper interconnect structure. A holding tank that contains anti-corrosive fluid is used to queue the wafers until subsequent scrubbing operations (,). A scrubbing operation (,) that is substantially void of light is used to reduce photovoltaic induced corrosion of copper in the drying chamber of the scrubber.

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Abbas Guvenilir