Varian Semiconductor Equipment Associates, Inc.

Applied Materials, Inc.

Aaron Webb

Charles T Carlson

William Tyler Weaver

Robert Brent Vopat

James D Strassner

Jason M Schaller

Christopher Neil Grant

Benjamin B Riordon

Timothy J Miller

David T Blahnik

Gary Wyka

Tammy Jo Pride

Michael Robert Rice

Frank Sinclair

Joseph Yudovsky

Nir Merry

Paul J Murphy

Timothy Joseph Franklin

Vinay K Shah

Michael C Kuchar

Paul E Pergande

Lawrence Randolph Gravell

Andrew J Constant

Jeffrey Charles Blahnik

Helder T Lee

Malcolm N Daniel, Jr

Efrain Quiles

Paul Forderhase

Michael Honan

Adam Brailove

Miriam Schwartz

Krag R Senior

Jaime A Carrera

Scott A Smith

Gary J Rosen

Luigi G Amato

Chris Czajka

Theodoss Costuros

Michael A Beck

Michael C Simmons

An ion implantation system including an ion source for generating an ion beam, an end station for holding a substrate to be implanted by the ion beam, and a linear accelerator disposed between the ion source and the end station and adapted to accelerate the ion beam, the linear accelerator comprising at least one acceleration stage including a resonator coil coupled to a drift tube assembly, the drift tube assembly including a first drift tube coupled to a first end of a first insulting rod via interference fit, a second drift tube coupled to a first end of a second insulting rod via interference fit, and a mounting bracket coupled to a second end of the first insulting rod and to a second end of the second insulting rod via interference fit.

Method of assembling drift tube assemblies in ion implantors

A coil inductor for use with a LINAC is disclosed. The coil inductor comprises one or more tubes, wherein each tube comprises an interior support structure to strengthen the tubes. By supporting the tube, the amount of vibration is reduced, allowing the coil to resonate at its natural frequency. In some embodiments, the interior structure comprises one or more interior walls. These interior walls may be used to create a plurality of fluid channels that allow the flow of coolant through the tubes. An end cap may be disposed on the second end of the tubes to allow fluid communication between the supply fluid channels and the return fluid channels. The first ends of the one or more tubes may be connected to a manifold that includes a supply port and a return port for the passage of coolant.

Stiffened RF LINAC coil inductor with internal support structure

The present disclosure generally relates to an isolation device for use in processing systems. The isolation device has a body with an inlet opening disposed at a first end coupled to a processing system component such as a remote plasma source and outlet openings, for example two, disposed at a second end which are coupled to a processing system component such as a process chamber. Flaps disposed within the body are actuatable to an open position from a closed position or to a closed position from an open position, to selectively allow or prevent passage of a fluid from the processing system component coupled to the isolation device to the other processing system component coupled thereto.

Dual port remote plasma clean isolation valve

Embodiments of the disclosure generally relate to a flapper valve. The flapper valve may be used with processing chambers, such as semiconductor substrate processing chambers. In one embodiment, a flapper valve includes a housing having a first opening at a first end thereof and a second opening at a second end thereof, a first flapper pivotably disposed in the housing, and a second flapper pivotably disposed in the housing. The first and second flappers are movable to selectively open and close at least one of the first opening and the second opening.

Low particle protected flapper valve

Apparatuses for annealing semiconductor substrates, such as a batch processing chamber, are provided herein. The batch processing chamber includes a chamber body enclosing an internal volume, a cassette moveably disposed within the internal volume and a plug coupled to a bottom wall of the cassette. The chamber body has a hole through a bottom wall of the chamber body and is interfaced with one or more heaters operable to maintain the chamber body at a temperature of greater than 290&#xb0; C. The cassette is configured to be raised to load a plurality of substrates thereon and lowered to seal the internal volume. The plug is configured to move up and down within the internal volume. The plug includes a downward-facing seal configured to engage with a top surface of the bottom wall of the chamber body and close the hole through the bottom wall of the chamber body.

High pressure steam anneal processing apparatus

An ion implanter and method for facilitating expeditious performance of maintenance on a component of the ion implanter in a manner that reduces downtime while increasing throughput of the ion implanter. The ion implanter includes a process chamber, a transfer chamber connected to the process chamber, a first isolation gate configured to controllably seal the transfer chamber from the process chamber, and a second isolation gate configured to controllably seal the transfer chamber from an atmospheric environment, wherein a component of the ion implanter can be transferred between the process chamber and the transfer chamber for performing maintenance on the component outside of the process chamber. Performing maintenance on a component of the ion implanter includes the steps of transferring the component from the process chamber to the transfer chamber, sealing the transfer chamber, venting the transfer chamber to atmospheric pressure, an opening the transfer chamber to an atmospheric environment.

Transfer chamber and method of using a transfer chamber

An active substrate alignment system for an ion implanter, the system including a platen, a registration device adapted to selectively move a substrate engagement surface disposed adjacent the platen for limiting movement of a substrate disposed on the platen, a camera configured to capture an image of the substrate before the substrate is disposed on the platen, and a controller in communication with the camera and the registration device, the controller configured to command the registration device to move the substrate engagement surface based on the image to limit movement of the substrate in a predetermined manner.

Active substrate alignment system and method

An improved system for measuring the temperature of a plurality of workpieces in a rotating semiconductor processing device is disclosed. Because silicon has variable emissivity in the infrared band, a temperature stable, high emissivity coating is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating. Further, by limiting the amount of coating applied to the workpiece, the effect of the coating on the intrinsic temperature of the workpiece and the surrounding semiconductor processing device may be minimized. The temperature of the workpieces is measured as the workpieces pass under an aperture by capturing a thermal image of a portion of the workpiece. In certain embodiments, a controller is used to process the plurality of thermal images into a single thermal image showing all of the workpieces disposed within the semiconductor processing device.

System and method to monitor semiconductor workpiece temperature using thermal imaging

One embodiment of this workpiece handling system has conveyor belts and a load lock. A first swap robot holds and transports workpieces between a build station and the load lock. A gantry robot transports the workpieces between each of the conveyor belts and the first swap robot. In one instance, processed workpieces are transported from the first swap robot to a first conveyor belt and unprocessed workpieces are transported from a second conveyor belt to the first swap robot using the gantry robot. A second swap robot also may be used with the first swap robot to load and unload workpieces from the load lock.

Workpiece handling system and methods of workpiece handling

A shielding device for shielding an edge of a semiconductor substrate can include a multisided frame defining a perimeter of an enclosed area, and a shield coupled to the frame. The shield may be configured to move between a first position where the shield is retracted to the perimeter and a second position where shield advanced into the enclosed area. A method for processing a semiconductor substrate includes placing a semiconductor substrate in position in an implantation chamber, covering edges of the semiconductor substrate by pushing shields into engagement with the edges, performing an ion implantation procedure, and retracting the shields from the edges.

Shielding device for substrate edge protection and method of using same

A mask alignment system for providing precise and repeatable alignment between ion implantation masks and workpieces. The system includes a mask frame having a plurality of ion implantation masks loosely connected thereto. The mask frame is provided with a plurality of frame alignment cavities, and each mask is provided with a plurality of mask alignment cavities. The system further includes a platen for holding workpieces. The platen may be provided with a plurality of mask alignment pins and frame alignment pins configured to engage the mask alignment cavities and frame alignment cavities, respectively. The mask frame can be lowered onto the platen, with the frame alignment cavities moving into registration with the frame alignment pins to provide rough alignment between the masks and workpieces. The mask alignment cavities are then moved into registration with the mask alignment pins, thereby shifting each individual mask into precise alignment with a respective workpiece.

Mask alignment system for semiconductor processing

A plurality of masks is attached to the underside of a mask frame. This attachment is made such that each mask can independently move relative to the mask frame in three directions. This relative movement allows each mask to adjust its position to align with respective alignment pins disposed on a working surface. In one embodiment, each mask is attached to the mask frame using fasteners, where the fasteners have a shaft with a diameter smaller than the diameter of the mounting hole disposed on the mask. A bias element may be used to allow relative movement between the mask and the mask frame in the vertical direction. Each mask may also have kinematic features to mate with the respective alignment pins on the working surface.

Mechanical alignment of substrates to a mask

A multi-part mask has a pattern plate, which includes a planar portion that has the desired aperture pattern to be used during workpiece processing. The multi-part mask also has a mounting frame, which is used to hold the pattern plate. Prior to assembly, the pattern plate has an aligning portion, which has one or more holes through which reusable alignment pins are inserted. These alignment pins enter kinematic joints disposed on the mounting frame, which serve to precisely align the pattern plate to the mounting frame. After the pattern plate has been secured to the mounting frame, the aligning portion can be detached from the pattern plate. The alignment pins can be reused at a later time. In some embodiments, the pattern plate can later be removed from the mounting frame, so that the mounting frame may be reused.

Multi-part mask for implanting workpieces

A cooling plate includes a channel to transmit a fluid, wherein the channel is disposed within a base and the channel has a first portion and a second portion. The first portion is disposed substantially along a peripheral edge of the base, and the second portion is coupled to the first portion and is disposed further away from the peripheral edge of the base than the first portion. The second portion has a length that is at least about 35% as long as the length of the first portion. The cooling plate also includes a lid disposed over the base and the channel, wherein the lid provides support for a substrate.

Cooling plates and semiconductor apparatus thereof

A carrier capable of holding one or more workpieces is disclosed. The carrier includes movable projections located along the sides of each cell in the carrier. This carrier, in conjunction with a separate alignment apparatus, aligns each workpiece within its respective cell against several alignment pins, using a multiple step alignment process to guarantee proper positioning of the workpiece in the cell. First, the workpieces are moved toward one side of the cell. Once the workpieces have been aligned against this side, the workpieces are then moved toward an adjacent orthogonal side such that the workpieces are aligned to two sides of the cell. Once aligned, the workpiece is held in place by the projections located along each side of each cell. In addition, the alignment pins are also used to align the associated mask, thereby guaranteeing that the mask is properly aligned to the workpiece.

Growing community of inventors

Austin, TX, United States of America

Aaron Webb