Intermolecular, Inc.

Other

Aaron T Francis

Kurt H Weiner

Gregory P Lim

John M Schmidt

Tony P Chiang

Rajesh Kelekar

Robert Anthony Sculac

Jeffrey Chih-Hou Lowe

Kenneth Alfred Williams

Sandeep Mariserla

Chi-I Lang

Satbir Kahlon

George Mirth

Kim Van Berkel

Frank C Ma

Glen Eric Egami

Kurt H Wiener

Brian Kennedy Foster

Ken Williams

Chucks for mounting and retaining semiconductor wafers during processing are described, particularly suited for wafer processing involving total immersion of the wafer-chuck structure in a liquid. Chuck structures are disclosed for preventing or hindering processing chemicals from contacting and contaminating large portions of the underside of the wafer undergoing processing, limiting such chemical contact to readily cleaned, relatively small annular regions on the periphery of the wafer. Embodiments include structures with supplemental gas flows on the underside of the wafer as well as the creation of gas/liquid meniscusci to prevent chemical penetration of the wafer's underside. Methods of processing semiconductor wafers employing such chucks are also described.

Chuck for mounting a semiconductor wafer for liquid immersion processing

Polishing and cleaning techniques are combinatorially processed and evaluated. A polishing system can include a reactor assembly having multiple reaction chambers, with at least a reaction chamber including a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Different downward forces can be applied to the polishing heads for evaluating optimum process conditions. Channels in the polishing pads can redistribute slurry and chemical to the polishing area.

Combinatorial tool for mechanically-assisted surface polishing and cleaning

Multiple waste streams, including incompatible chemicals such as concentrated acids and/or strong base effluents, are handled together without the need for limiting or interrupting the processes run by the wafer processing tools. In some embodiments, waste tanks are primed with diluents, such as water, and a predetermined percentage of diluent is maintained in the waste tanks. In some embodiments, a diluent is flowed into the waste tanks concurrently with the waste pumping to generate a rinsing action for the waste tanks. Methods of the present disclosure accommodate both gravity type and vacuum type waste tanks.

Effluent management, waste dilution, effluent pre-dilution, acid waste handling

In some embodiments of the present disclosure, an apparatus for combinatorial wet processing includes: a chuck, a substrate located on the chuck, a cell located over the substrate; and a height adjustment mechanism for the cell above the substrate wherein applying compressed air on an O-ring in a gland prevents vertical movement of the cell relative to the position of the substrate.

Pneumatic clamping mechanism for cells with adjustable height

A combinatorial processing system having modular dispense heads is provided. The modular dispense heads are disposed on a rail system enabling an adjustable pitch of the modular dispense heads for the combinatorial processing. The modular dispense heads are configured so that sections of the modular dispense heads are detachable in order to accommodate various processes through a first section without having to completely disconnect and re-connect facilities to a second section.

Modular flow cell and adjustment system

A vented combinatorial processing cell is described, including a sleeve having an end forming a fluid seal with a region of a substrate, a flow head including a vent and disposed in the sleeve to dispense fluid onto the region, the flow head, the substrate, and the sleeve defining a chamber for processing the region, a fluid source attached to the flow head to deliver the fluid into the chamber, and a vacuum port attached to the flow head to remove fluid from the chamber.

Vented combinatorial processing cell

A reactor assembly having vertically adjustable flow cells is provided. The vertically adjustable flow cells include passageways for distributing a fluid to a reaction region isolated below a bottom surface of corresponding flow cells. The adjustable flow cells enable another dimension of variability for combinatorial processing. Thus, additional data may be gathered for effects on process parameter variations, material variations, process sequence variations, etc., for semiconductor processing operations.

Volume combinatorial processing chamber

A cleaning assembly is provided. The cleaning assembly includes a plate having a front surface and a back surface and a manifold affixed to an edge of the plate. The manifold has a plurality of outlets extending therefrom. The plate further includes a plurality of cups extending through the plate. The plurality of cups have an upper body with an outlet extending from the back surface and the plurality of cups have a sealing portion coupled to the upper body and extending from the front surface of the plate. Each outlet of the upper body is coupled to one of the corresponding plurality of outlets of the manifold. The plate also includes a plurality of alignment pins extending from the front surface of the plate. The plurality of alignment pins are configured to support an edge of a substrate, wherein one of the plurality of alignment pins is slidably mounted to the plate. A plurality of guide pins extends the same distance from the back surface.

Ex-situ cleaning assembly

A gas bearing seal using porous materials for distribution of gas flow can provide site isolation during wet processing. In some embodiments, a flow cell comprises a porous media gas bearing surrounding a periphery of the flow cell, isolating the liquid inside the flow cell from the ambient air outside the flow cell. In some embodiments, a protective chuck comprises a porous media gas bearing disposed in a middle of the protective chuck, isolating the liquid outside the protective chuck with the gaseous ambient generated by the porous media gas bearing.

Touchless site isolation using gas bearing

Provided are methods and systems for dispensing different chemicals used for high productivity combinatorial processing. A dispense panel may include multiple inlet lines for supplying different chemicals. Each inlet line is connected to its own three-way valve that either allows the supplied chemical to flow from the inlet line towards a dispense valve connected to a dispense manifold (during dispensing of the supplied chemical) or allows another chemical to flow from the dispense valve to a waste manifold (during priming of the dispense manifold with this other chemical). Specifically, during priming a chemical supplied from its inlet line and is passed through a corresponding three-way valve and is directed to its dispense valve and then into the dispense manifold. Other dispense valves and three-way valves of the dispense panel allow this chemical to flow out of the dispense manifold, thereby priming remaining parts of the panel.

Methods and systems for dispensing different liquids for high productivity combinatorial processing

Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing.

Full wafer processing by multiple passes through a combinatorial reactor

Methods for combinatorially processing semiconductor substrates are provided. The methods may involve receiving a substrate into a combinatorial processing chamber and sealing a plurality of flow cells against a surface of the substrate. The plurality of flow cells is enclosed within the combinatorial processing chamber to define an enclosed external environment for the plurality of flow cells. A pressure differential is created between a reaction area of the plurality of flow cells of the combinatorial processing chamber and the external environment, wherein each flow cells of the plurality of flow cells defines a site isolating region of the substrate. The regions the substrate are then combinatorially processed.

Reactor cell isolation using differential pressure in a combinatorial reactor

A cleaning chamber is provided. The cleaning chamber includes a base portion housing a chuck and a lid affixed to the base portion. A support assembly is linked to the lid and the support assembly includes a top plate spaced apart from a bottom plate, the top plate has a plurality of openings defined therethrough and the bottom plate has a plurality of openings defined therethrough. The cleaning chamber includes a plurality of cups extending through corresponding pairs of the plurality of openings of the top plate and the bottom plate. The plurality of cups is configured to seal against a surface of a substrate, wherein each cup of the plurality of cups is independently supported by the bottom plate.

In-situ cleaning assembly

Substrate processing systems and methods are described for site-isolated processing of substrates. The processing systems include numerous site-isolated reactors (SIRs). The processing systems include a reactor block having a cell array that includes numerous SIRs. A sleeve is coupled to an interior of each of the SIRs. The sleeve includes a compliance device configured to dynamically control a vertical position of the sleeve in the SIR. A sealing system is configured to provide a seal between a region of a substrate and the interior of each of the SIRs. The processing system can include numerous modules that comprise one or more site-isolated reactors (SIRs) configured for one or more of molecular self-assembly and combinatorial processing of substrates.

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San Jose, CA, United States of America

Aaron T Francis