Sitime Corporation

Robert Boschgmbh

Leland Stanford Junior University

Akustica, Inc.

Robert Bosh Gmbh

Sitime Corpoaration

Aaron Partridge

Markus Lutz

Paul Merritt Hagelin

Charles I Grosjean

Pavan Gupta

Ginel C Hill

Silvia Kronmueller

Thor Juneau

David Raymond Pedersen

Sassan Tabatabaei

Renata Melamud Berger

Zhiyu Pan

Carl Arft

Michael Julian Daneman

Kamran Souri

Brian H Stark

Lijun Chen

Gary Yama

Joseph C Doll

Wilhelm Frey

Bernhard Boser

Crist Y Lu

Meisam Heidarpour Roshan

Thomas W Kenny

Markus Ulm

Nicholas Miller

Matthias Metz

Samira Zaliasl

Jasim Ahmed

Aleksandar Kojic

Yi Zhang

Robert N Candler

Jean-Pierre Hathout

Benjamin W Chui

Alissa M Fitzgerald

Volker Materna

Pan Zhiyu

Jospeh Kurth Reynolds

Trushal Chokshi

Lutz Markus

A microelectromechanical system (MEMS) resonator includes a substrate having a substantially planar surface and a resonant member having sidewalls disposed in a nominally perpendicular orientation with respect to the planar surface. Impurity dopant is introduced via the sidewalls of the resonant member such that a non-uniform dopant concentration profile is established along axis extending between the sidewalls parallel to the substrate surface and exhibits a relative minimum concentration in a middle region of the axis.

Non-lid-bonded MEMS resonator with phosphorus dopant

The present inventions, in one aspect, are directed to micromachined resonator comprising: a first resonant structure extending along a first axis, wherein the first axis is different from a crystal axis of silicon, a second resonant structure extending along a second axis, wherein the second axis is different from the first axis and the crystal axis of silicon and wherein the first resonant structure is coupled to the second resonant structure, and wherein the first and second resonant structures are comprised of silicon (for example, substantially monocrystalline) and include an impurity dopant (for example, phosphorus) having a concentrations which is greater than 10cm, and preferably between 10cmand 10cm.

Resonant elements and oscillators

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

MEMS resonator integrated cicruit fabrication

A MEMS element within a semiconductor device is enclosed within a cavity bounded at least in part by hydrogen-permeable material. A hydrogen barrier is formed within the semiconductor device to block propagation of hydrogen into the cavity via the hydrogen-permeable material.

MEMS with small-molecule barricade

An oscillator includes a resonator, sustaining circuit and detector circuit. The sustaining circuit receives a sense signal indicative of mechanically resonant motion of the resonator generates an amplified output signal in response. The detector circuit asserts, at a predetermined phase of the amplified output signal, one or more control signals that enable an offset-reducing operation with respect to the sustaining amplifier circuit.

Cascaded oscillator designs

A microelectromechanical system (MEMS) resonator includes a resonant semiconductor structure, drive electrode, sense electrode and electrically conductive shielding structure. The first drive electrode generates a time-varying electrostatic force that causes the resonant semiconductor structure to resonate mechanically, and the first sense electrode generates a timing signal in response to the mechanical resonance of the resonant semiconductor structure. The electrically conductive shielding structure is disposed between the first drive electrode and the first sense electrode to shield the first sense electrode from electric field lines emanating from the first drive electrode.

Resonator electrode shields

Low Allan-deviation oscillator

MEMS resonator with colocated temperature sensor

In a high resolution temperature sensor, first and second MEMS resonators generate respective first and second clock signals and a locked-loop reference clock generator generates a reference clock signal having a frequency that is phase-locked to at least one of the first and second clock signals. A frequency-ratio engine within the MEMS temperature sensor oversamples at least one of the first and second clock signals with the reference clock signal to generate a ratio of the frequencies of the first and second clock signals.

Dual-MEMS device with temperature correction of MEMS output based on relative MEMS operation

MEMS resonator system

One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state 'oven' temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).

Ovenized MEMS

MEMS resonator with beam segments having predefined angular offset to each other and to resonator silicon crystal orientation

In various time-transfer systems, one or more fixed-position time beacons broadcast radio-frequency (RF) time-transfer messages to time-keeping modules disposed in remote radio heads and other strategic locations to achieve highly reliable and accurate synchronized time, phase, and frequency transfer over a metropolitan or other wide-field area.

Time module apparatus for use with fixed-beacon time transfer system

Multi-die integrated circuit package

Growing community of inventors

Cupertino, CA, United States of America

Aaron Partridge