Raytheon Company

Aaron Michael Torberg

Thomas V Sikina

James E Benedict

Andrew R Southworth

Mikhail Pevzner

Kevin Wilder

Matthew Souza

An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

Method for fabricating Z-axis vertical launch

Apparatus for fabricating Z-axis vertical launch within a printed circuit board

Growing community of inventors

East Waterboro, ME, United States of America

Aaron Michael Torberg