Seagate Technology Incorporated

Msp Corporation

Aaron Michael Collins

Paul Davidson

Benjamin Y H Liu

Thuc M Dinh

Francisco J Romay

William Dick

Scott Daemon Matzke

Venkateswara R Inturi

Joseph Michael Stephan

Ralph Smith

Christopher Unger

Lars Halvar Ahlen

Greg Arthur Schmitz

Robbee Lee Grimm

Robert Aaron Newman

Joseph A Nelson

Daniel Richard Buettner

Scott Damon Matzke

Christopher R Libby

Methods are described for forming a mounting surface on a slider body. In one method, an adhesion layer can be deposited on a top surface of a slider body. A first photolithography cycle deposits a first metal layer having a first thickness of at least 8 &#x3bc;m. A second photolithography cycle deposits a second metal layer having a second thickness of at least 8 &#x3bc;m over the first metal layer. The first and second layer form a mounting support on the top surface. In another method, the top surface is etched to form a mounting support.

Mounting supports that create a bond pad gap for a hard disk slider

A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to and at an angle relative to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube having tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to liquefy the solder sphere until it falls from the exit orifice, waiting for a predetermined time period after the liquefied solder sphere has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.

Method of forming electrical connections with solder dispensing and reflow

A slider includes a slider body with an air-bearing surface and a top surface opposing the air-bearing surface. A plurality of slider bond pads are disposed on or parallel to the top surface and proximate to or at a trailing edge of the slider. The plurality of slider bond pads have an exposed surface facing away from the top surface of the slider body. One or more mounting supports extend from the top surface to a distance of at least 12 &#x3bc;m above the exposed surface of the plurality of slider bond pads.

An apparatus includes a hopper configured to receive a plurality of solder microspheres, and a moveable singulation device positioned proximate to and below the hopper. The moveable singulation device is configured to receive the plurality of solder microspheres from the hopper as the plurality of microspheres exit the hopper. The movable singulation device includes a plurality of holes, with each of the plurality of holes configured to receive a single solder microsphere of the plurality of solder micro spheres. The apparatus further includes a piezoelectric vibration device configured to provide ultrasonic vibrations to the singulation device, thereby preventing agglomeration of the plurality of solder microspheres in the hopper.

Fluidization of agglomerated solder microspheres

A method of controlling a shape and size of at least one solder joint of a magnetic recording head that includes a trailing surface and a plurality of bond pads, wherein each bond pad comprises a base layer comprising a top surface and a top edge, the method including the steps of forming at least one solder dam by covering a portion of the top surface of the base layer of at least one of the bond pads with a coating layer that comprises a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads, thereby defining a coated portion and an uncoated portion of the base layer, and applying solder material to the uncoated portion of the base layer adjacent to the solder dam so that the coating layer constrains movement of the solder material beyond the uncoated portion.

Methods of controlling a shape and size of solder joints of magnetic recording heads

A magnetic recording head is provided including a body with a trailing surface, a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes a base layer having a top surface, a coating layer covering at least a portion of the top surface of the base layer, two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, a top edge extending between the two side edges, and at least one solder dam comprising a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads.

Electrically conductive solder non-wettable bond pads in head gimbal assemblies

A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.

Method of forming electrical connections using optical triggering for solder

An apparatus includes a slider which includes a slider body with a leading edge and a trailing edge and a plurality of slider bond pads disposed at the trailing edge. The slider bond pads are configured to align opposite to suspension trace bond pads on a suspension to form a solderable gap between the slider bond pads and the suspension trace bond pads.

Slider with bondable surface opposite suspension trace

An apparatus includes a slider body with a first portion formed of a first insulating material and a second portion formed of a second insulating material that is different from the first insulating material. The second portion of the slider body is at a trailing edge of the slider body and the second portion includes a bearing surface and a top surface opposite the bearing surface. A plurality of bond pads are disposed on the top surface of the second portion such that an entire bottom surface of each of the plurality bond pads is attached to the top surface of the second portion.

Slider with trailing edge top bond pad interconnect

A method for interconnecting multiple components of a head-gimbal assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area between the first and second components, dispensing a solder sphere to a capillary tube comprising tapered walls, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, pressurizing the capillary tube until a predetermined pressure is reached, applying a first laser pulse to the solder sphere to provide a level of thermal energy to liquefy the solder sphere, detecting the movement of the liquefied solder sphere after it has exited the exit orifice of the capillary tube, and applying a second laser pulse to reflow the solder sphere to create the solder joint between the first and second components.

A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.

Method of forming electrical connections from solder posts

The present disclosure describes a method and apparatus for detecting particles in a gas by saturating the gas with vapor and causing the gas to flow through a chamber with walls that are at a temperature different than the temperature of the entering gas creating a gas turbulence within the chamber resulting in the gas becoming super-saturated with vapor and causing said super-saturated vapor to condense on said particles and form droplets, which are then detected and counted by an optical light-scattering detector.

Apparatus for counting particles in a gas

The present disclosure describes an apparatus for detecting particles in a gas by saturating the gas with vapor and causing the gas to flow through a chamber with walls that are at a temperature different than the temperature of the entering gas creating a gas turbulence within the chamber resulting in the gas becoming super-saturated with vapor and causing said super-saturated vapor to condense on said particles and form droplets, which are then detected and counted by an optical light-scattering detector.

A method for detecting particles in a gas by saturating the gas with vapor and causing the gas to flow through a chamber with walls that are at a temperature different than the temperature of the entering gas creating a gas turbulence within the chamber resulting in the gas becoming super-saturated with vapor and causing said super-saturated vapor to condense on said particles and form droplets, which are then detected and counted by an optical light-scattering detector.

Growing community of inventors

Minneapolis, MN, United States of America

Aaron Michael Collins