Lucent Technologies Inc.

At+t Corp.

Aaron L Frank

Dennis L Krause

Ajibola O Ibidunni

Douglas B Johnson

Trac Nguyen

Yaw S Obeng

Jennifer S Obeng

The present invention provides an electrolytic cell for use in a process for real time monitoring of a chemical bath used in the fabrication of a semiconductor wafer and having different metal ions therein. In one embodiment, the electrolytic cell comprises a fluid chamber having an inlet, an outlet and chamber walls, and channel electrodes coupled to the chamber walls. The inlet and outlet permit a throughflow of at least of a portion of the chemical bath. Each of the channel electrodes corresponds to one of the different metal ions. Each channel electrode is energized to a detection potential selected to provide electrical conduction when the corresponding different metal ion reaches a prescribed concentration.

In-situ method for real time monitoring of chemical baths for transition metals with multi-channel electrodes

Multilayer circuit devices include a plurality of metallized patterns thereon, said patterns being separated by a polymeric dielectric film. The various metallized patterns are interconnected by means of microvias through the polymeric film or films. Each of the metallizations is a composite including in succession from the substrate or from the polymeric film, a layer of titanium (Ti), a layer of titanium and palladium alloy (Ti/Pd), a layer of copper (Cu), and a layer of titanium and palladium alloy (Ti/Pd). The Ti-Ti/Pd-Cu-Ti/Pd composite is hereinafter referred to as TCT. The adhesion between the polymeric film and the top Ti/Pd layer is better than that between the polymer and gold (Au) and comparable to that between the polymer and an adhesion promoted Au layer. Use of the TCT metallization also results in additional cost reduction due to the elimination of Ni and Au layers on top of the Cu layer.

Metallization for polymer-dielectric multichip modules

Multilayer circuit devices include a plurality of metallized patterns thereon, said patterns being separated by a polymeric dielectric film. The various metallized patterns are interconnected by means of microvias through the polymeric film or films. Each of the metallizations is a composite including in succession from the substrate or from the polymeric film, a layer of titanium (Ti), a layer of titanium and palladium alloy (Ti/Pd), a layer of copper (Cu), and a layer of titanium and palladium alloy (Ti/Pd). The Ti--Ti/Pd--Cu--Ti/Pd composite is hereinafter referred to as TCT. The adhesion between the polymeric film and the top Ti/Pd layer is better than that between the polymer and gold (Au) and comparable to that between the polymer and an adhesion promoted Au layer. Use of the TCT metallization also results in additional cost reduction due to the elimination of Ni and Au layers on top of the Cu layer.

Metallization for polymer-dielectric multichip modules including a Ti/Pd

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Malden, MA, United States of America

Aaron L Frank