Creeled, Inc.

Cree Gmbh

Aaron James Francis

Colin Kelly Blakely

Robert Wilcox

Jasper S Cabalu

Kyle Damborsky

Michael John Bergmann

Derek Miller

Solid-state lighting devices including light-emitting diodes (LEDs) and lens arrangements for packaged LED devices are disclosed. An LED package may include one or more LED chips on a submount with a lens positioned on the submount to form a cavity. The one or more LED chips may reside in the cavity without direct encapsulation materials that would otherwise contact the one or more LED chips and any corresponding wirebonds. In this manner, the one or more LED chips may be driven with higher drive currents while reducing degradation and mechanical strain effects related to differences in coefficients of thermal expansion with typical encapsulant materials. LED packages may also be configured with one or more apertures that allow air flow between an interior volume of a cavity and an ambient environment outside the LED package to promote heat dissipation at higher drive currents.

Lens arrangements for light-emitting diode packages

Solid-state lighting devices including light-emitting diodes (LEDs), and more particularly packaged LED devices are disclosed. LED packages are disclosed herein with arrangements of LED chips and corresponding lumiphoric regions that are configured to provide overall light emissions having improved color mixing and emission uniformity. LED packages are further disclosed herein that are configured to be tunable between different colors or correlated color temperatures (CCTs) while providing improved color mixing and emission uniformity. Arrangements may include differing lumiphoric regions that are arranged with various alternating patterns including one or more intersecting lines, rows of alternating lumiphoric regions, patterns that alternate in at least two directions, and checkerboard patterns.

Lumiphoric arrangements for light emitting diode packages

Light emitting devices and components having excellent chemical resistance and related methods are disclosed. In one embodiment, an LED device or package with an encapsulant material or lens disposed over at least a portion of the LED device or package and a poly(methyl) acrylate-silicon containing barrier coating at least partially disposed over the encapsulant or the lens provides corrosion protection to corrodible metals and/or moisture protection to moisture sensitive components.

Clear coating for light emitting device exterior having chemical resistance and related methods

Light emitting diode (LED) components include a submount, at least one or more LED chip wirebonded on a first surface of the submount to electrical traces at the edges of the submount, and a molded encapsulant which is devoid of a curved lens or hemispherical lens and can have outer or lateral walls co-planar with exterior walls of the submount. An LED component can have a viewing angle that is greater than 125&#xb0;. A method of providing an LED component includes providing a substantially flat submount, attaching one or more LED chip over a first surface of the submount, dispensing an encapsulant over the first surface of the submount over the LED chips, applying a press over the encapsulant to apply a heat and/or pressure to the encapsulant, and molding the encapsulant over the first surface of the submount.

Growing community of inventors

Apex, NC, United States of America

Aaron James Francis