Lam Research Corporation

Advanced Inquiry Systems, Inc.

Translarity, Inc.

Other

Lam Research Foundation

Aaron Durbin

Morgan T Johnson

Ramesh Chandrasekharan

David Keith

Jose A Santos

Dirk Rudolph

Thomas G Jewell

Sairam Sundaram

Rachel E Batzer

Aaron Blake Miller

Vivekanandan Krishnaswamy

A temperature-controlled substrate support for a substrate processing system includes a substrate support and a controller. The substrate support includes N zones and N resistive heaters, respectively, where N is an integer greater than one, and a temperature sensor located in one of the N zones. The controller is configured to calculate N resistances of the N resistive heaters during operation and adjust power to N−1 of the N resistive heaters during operation of the substrate processing system in response to a temperature measured by the temperature sensor located in the one of the N zones and the N resistances of the N resistive heaters.

Dual zone heaters for metallic pedestals

A temperature-controlled substrate support for a substrate processing system includes a substrate support located in the processing chamber. The substrate support includes N zones and N resistive heaters, respectively, where N is an integer greater than one. A temperature sensor is located in one of the N zones. A controller is configured to calculate N resistances of the N resistive heaters during operation and to adjust power to N−1 of the N resistive heaters during operation of the substrate processing system in response to the temperature measured in the one of the N zones by the temperature sensor, the N resistances of the N resistive heaters, and N−1 resistance ratios.

Dynamic temperature control of substrate support in substrate processing system

High density hole pattern dual plenum hole showerhead assembly

A method for controlling temperature of a substrate support includes receiving first and second currents corresponding to first and second heater elements, respectively, of a substrate support, receiving first and second voltages corresponding to the first and second heater elements, respectively, calculating a first resistance of the first heater element based on the first voltage and the first current, calculating a second resistance of the second heater element based on the second voltage and the second current, calculating a first temperature of a first zone of the substrate support based on the first resistance and stored data correlating resistances to temperatures, calculating a second temperature of a second zone of the substrate support based on the second resistance and the stored data, and selectively adjusting the stored data based on a comparison between a sensed temperature and at least one of the calculated first temperature and second temperature.

Use of voltage and current measurements to control dual zone ceramic pedestals

A controller for a substrate processing system includes a resistance calculation module configured to receive a first current and a second current corresponding to a first heater element and a second heater element, respectively, of a substrate support, receive a first voltage and a second voltage corresponding to the first heater element and the second heater element, respectively, calculate a first resistance of the first heater element based on the first voltage and the first current, and calculate a second resistance of the second heater element based on the second voltage and the second current. A temperature control module is configured to separately control power provided to the first heater element and the second heater element based on the first resistance and the second resistance, respectively, and respective relationships between the first and second resistances and first and second temperatures of the substrate support.

A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer test system includes an interposer having a first surface and a second surface facing away from the first surface. The system also includes a wafer translator having a first side facing the second surface of the interposer and a second side facing away from the first side and toward a wafer, the first side carrying a plurality of first terminals at a first scale and the second side carrying a plurality of second terminals at a second scale. The first scale is greater than the second scale.

Wafer testing system and associated methods of use and manufacture

A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.

A wafer translator and a wafer, removably attached to each other, provides the electrical connection to electrical contacts on integrated circuits on a wafer in such a manner that the electrical contacts are substantially undamaged in the process of making such electrical connections. Various embodiments of the present invention provide a gasketless sealing means for facilitating the formation by vacuum attachment of the wafer/wafer translator pair. In this way, no gasket is required to be disposed between the wafer and the wafer translator. Air, or gas, is evacuated from between the wafer and wafer translator through one or more evacuation pathways in the gasketless sealing means.

Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed

Maintaining a wafer/wafer translator pair in an attached state free of a gasket diposed

A wafer testing system and associated methods of use an manufacture are disclosed herein. In one embodiment, the wafer testing system includes an assembly for releaseably attaching a wafer to a wafer translator and the wafer translator to an interposer by means of separately operable vacuums, or pressure differentials. The assembly includes a wafer translator support ring coupled to the wafer translator, wherein a first flexible material extends from the wafer translator support ring so as to enclose the space between the wafer translator and the interposer so that the space may be evacuated by a first vacuum through one or more first evacuation paths. The assembly can further include a wafer support ring coupled to the wafer and the chuck, wherein a second flexible material extends from wafer support ring so as to enclose the space between the wafer and the wafer translator so that the space may be evacuated by a second vacuum through one or more second evacuation pathways.

Growing community of inventors

Portland, OR, United States of America

Aaron Durbin