Intel Corporation

Aaron Dean Hale

David Gregory Figueroa

Michael Walk

Toshimi Kohmura

Joan K Vrtis

An electronic package ( , FIG. ) includes one or more capacitors ( ) embedded within one or more layers ( ) of the package. The embedded capacitors are discrete devices, such as integrated circuit capacitors (FIGS. ) or ceramic capacitors. During the package build-up process, the capacitors are mounted ( , FIG. ) to a package layer, and a non-conductive layer is applied ( ) over the capacitors. When the build-up process is completed, the capacitor's terminals ( , FIG. ) are electrically connected to the top surface of the package. The embedded capacitor structure can be used in an integrated circuit package ( , FIG. ), an interposer ( ), and/or a printed circuit board ( ).

Growing community of inventors

Chandler, AZ, United States of America

Aaron Dean Hale