Motorola Corporation

Aaron B Mullins

Michael H Bartlett

Andrew T Morrison

A circuit carrying substrate (108) accommodates circuit components (102) with different coefficients of expansion and contraction from that of the circuit carrying substrate (108). Beneath the components (102) a plurality of slots (104) are formed so as to minimize the effects of the differing coefficients of expansion and contraction.

Compliancy tolerant pattern for circuit carrying substrate

An EMI/RFI shield (10) comprises a box like structure formed of a metal integral member having a plurality of apertures (16) formed therethrough. The apertures (16) are of a size appropriate to substantially pass infrared energy (22) and to substantially block EMI/RFI energy (26). When placed on a substrate (18), infrared energy (22) can be utilized to reflow solder a device (19) encapsulated by the shield (10) to the substrate (18).

Method and apparatus for EMI/RFI shielding an infrared energy reflow

Disclosed is an improved housing being comprised of a substrate and a cover that is plated to provide RF shielding. The substrate and cover are constructed of a like material to keep the coefficients of vibration approximately identical. Preferably, the substrate and cover material are ceramic thereby providing a rigid structure that minimizes vibration degradation.

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Hurst, TX, United States of America

Aaron B Mullins