Valtion Teknillinen Tutkimuskeskus

Kyocera Technologies Oy

Teknologian Tutkimuskeskus Vtt Oy

Nokia Corporation

Kyocera Tikitin Oy

Nokia Technologies Oy

Nokia Siemens Networks Oy

Aarne Oja

Antti Jaakkola

Tomi Juha Mattila

Heikki Sepp&auml;

Heikki Seppä

Tuomas Pensala

Johanna Meltaus

Jaakko Saarilahti

Ville Saarela

Olli Jaakkola

Panu Koppinen

James Dekker

Ari Alastalo

Kirsi Tappura

Panu Pekko

Ville Kaajakari

Mika Suhonen

Teuvo Sillanpaa

Tomi Mattila

Jussi Tuppurainen

Hannu Helle

Heikki Seppā

A silicon microelectromechanical system, MEMS, resonator assembly, includes four flexural beam elements forming a rectangular frame, each beam element being connected at an end thereof to an end of a neighboring one of the beam elements. The resonator assembly further includes connection elements for connecting the rectangular frame to at least one mechanical anchor, and the resonator assembly supporting an in-plane flexural collective resonance mode.

Microelectromechanical system resonator assembly

A microelectromechanical (MEMS) resonator includes a spring-mass system having a first weight portion (M), a second weight portion (M), and a central spring portion (SP) in between the weight portions. The weight portions are connected (or mechanically attached) to the central spring portion and thus improving stability.

Spring-mass microelectromechanical resonator

A MEMS (microelectromechanical system) resonator with a material layer of single-crystalline silicon, at least one layer made of material with low thermal diffusivity to reduce thermoelastic dissipations in the MEMS resonator, a layer of piezoelectric material, and a layer made of electrically conducting material. The layer with low thermal diffusivity is between the single-crystalline silicon layer and the piezoelectric layer, or between the piezoelectric layer and the electrically conducting layer. The use of a material layer of low thermal diffusivity.

MEMS resonator with high quality factor and its use

A microelectromechanical resonator, including a support structure, a resonator element suspended to the support structure, the resonator element including a plurality of sub-elements, and an actuator for exciting the resonator element into a resonance mode. The sub-elements are dimensioned such that they are dividable in one direction into one or more fundamental elements having an aspect ratio different from 1 so that each of the fundamental elements supports a fundamental resonance mode, which together define a compound resonance mode of the sub-element. The sub-elements are further coupled to each other by connection elements and positioned with respect to each other such that the fundamental elements are in a rectangular array configuration, wherein each fundamental element occupies a single array position, and at least one array position of the array configuration is free from fundamental elements.

MEMS resonator array arrangement

The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.

Surface micromechanical element and method for manufacturing the same

A temperature-compensated microelectromechanical oscillator and a method of fabricating thereof. The oscillator includes a resonator element including highly doped silicon and an actuator for exciting the resonator body into a resonance mode having a characteristic frequency-vs-temperature curve. The properties of the resonator element and the actuator are chosen such that the curve has a high-temperature turnover point at a turnover temperature of 85&#xb0; C. or more. In addition, the oscillator comprises a thermostatic controller for keeping the temperature of the resonator element at said high turnover temperature.

Oven-controlled frequency reference oscillator and method of fabricating thereof

The present disclosure describes micromechanical resonator, a resonator element for the resonator, and a method for trimming the resonator. The resonator comprises a resonator element having a length, a width, and a thickness, where the length and the width define a plane of the resonator element. The resonator element comprises at least two regions () in the plane of the resonator element, wherein the at least two regions have different thicknesses.

Micromechanical resonator and method for trimming micromechanical resonator

A frequency reference oscillator device and method of providing a frequency reference signal. The oscillator device includes a first oscillator including a first resonator having first long-term stability and a first frequency-vs-temperature turnover temperature, the first oscillator being capable of providing a first frequency signal. Further, the device includes and a second oscillator including a second resonator having second long-term stability, which is inferior to the first long-term stability, and a second frequency-vs-temperature turnover temperature, the second oscillator being capable of providing a second frequency signal. There is also provided a thermostatic controller for adjusting the temperature of the first resonator essentially to said first turnover temperature and the temperature of the second resonator essentially to said second turnover temperature, and a stability control circuit configured to use the first frequency signal for adjusting the second oscillator for providing a temperature stabilized and long-term stabilized output frequency signal.

Frequency reference oscillator device and method of stabilizing a frequency reference signal

The present invention relates to a micromechanical sensor for analyzing liquid samples and an array of such sensors. The invention also concerns a method for sensing liquid samples and the use of longitudinal bulk acoustic waves for analyzing liquid phase samples micromechanically. The sensor comprises a body and a planar wave guide portion spaced from the body. At least one electro-mechanical transducer element are used for excitation of longitudinal bulk acoustic waves to the wave guide portion in response to electrical actuation and for converting acoustic waves into electrical signals. The wave guide portion is provided with a sample-receiving zone onto which the sample can be introduced. By means of the invention, the sensitivity of micromechanical liquid sensors can be improved.

Micromechanical sensor, sensor array and method

Method for stabilizing the frequency of a MEMS (Micro Electro Mechanical Systems) reference oscillator, and a MEMS reference oscillator, wherein the method comprises following steps: using two or more MEMS components, wherein each MEMS component is characterized by a set of properties, and selectively combining the desired properties from the MEMS components.

Reference oscillator frequency stabilization

Method for stabilizing the frequency of a frequency synthesizer by means of a reference oscillator unit coupled to a voltage controlled oscillator (VCO) and a frequency synthesizer, wherein the synthesizer is provided with a phase locked loop (PLL) to stabilize the operation of the voltage controlled oscillator, wherein the reference oscillator unit is a MEMS (MicroElectromechanicalSystems) reference oscillator unit, the temperature of the MEMS reference oscillator unit is measured, and the output frequency is corrected according to the measured temperature by using a frequency/temperature function.

Multi-mode frequency synthesizer with temperature compensation

An AC/DC voltage reference system has at least one micromechanically fabricated electrode pair having first and second electrodes facing each other so that the electrodes are disposed at a distance from each other, whereby at least one of the electrodes is movable against a spring force. An AC signal is applied over the electrodes to establish an electrostatic force at a frequency substantially higher than the effective mechanical resonant frequency of the movable electrode. The system further includes an apparatus for detecting the AC voltage applied between the electrodes, thus forming an AC voltage reference.

Micromechanical alternating and direct voltage reference apparatus

The invention relates to a method for controlling by electrical means the interelectrode distance of such a micromechanical electrode structure &lsqb;( )&rsqb; in which at least one electrode &lsqb;( )&rsqb; is attached elastically suspended on the surrounding structure, whereby the elastic properties of each electrode and the electrical control applied over the electrodes determine the interelectrode distance. According to the invention, the distance between the electrodes &lsqb;( )&rsqb; is controlled by controlling the AC control current passing via the electrodes &lsqb;( )&rsqb;.

Method and system for electrically controlling the spacing between micromechanical electrodes

The invention concerns a silicon micromechanical weight sensor ( ). According to the invention, the weight sensor comprises at least two conducting electrodes ( ) displaced at a distance from each other, whereby one of the elastically suspended electrode surfaces ( ) or, alternatively, a structure connected thereto, acts as the pan surface of the weight sensor.

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Espoo, Finland

Aarne Oja