Te Connectivity Solutions Gmbh

Aakriti Kharel

Chad William Morgan

David Patrick Orris

Megan Hoarfrost Beers

Bruce Allen Champion

Dwight David Zitsch

Jessica H B Hemond

Henry Burton Piper, Iii

Jason Thomas Chiota

An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is adjusted to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.

Electrical connector using tunable hot melt adhesive material

An electrical connector assembly having a printed circuit board, signal wires, and an impedance mold. The signal wires transmit signals at a determined signal speed. The signal wires have ends which are connected to the printed circuit board. The impedance mold cooperates with the printed circuit and the signal wires. The impedance mold is formed from a tunable hot melt adhesive composition. A dielectric constant of the tunable hot melt adhesive composition is lowered to be compatible with the desired signal performance characteristics of the signals transmitted over the signal wires to the printed circuit board.

A method of preparing an overmolded optical fiber assembly comprising: (a) placing at least one flexible optical circuit in a bottom mold, said bottom mold defining a bottom overmold cavity having a bottom surface, said at least one flexible optical circuit having a substrate and a plurality of fibers adhered to said substrate, said substrate being disposed within said bottom overmold cavity to define a first space between said substrate and said bottom surface; (b) flowing a polymer in at least said first space; (c) placing a top mold over said substrate, said top mold defining a top overmold cavity and a top surface and a port defined in said top surface to access said top overmold cavity, said substrate defining a second space between said top surface and said substrate; (d) flowing a polymer in at least a portion of said second space; and (e) removing said bottom and top molds to release said overmolded optical circuit.

Overmolded optical circuits

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San Jose, CA, United States of America

Aakriti Kharel