Teledyne Industries, Inc.

A Roland Caron

Lee J Millette

Joseph A Thoman

Robert S Larmouth

Sandra L Jean

James E Keating

John G King

A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.

Multilayer combined rigid/flex printed circuit board containing flexible soldermask

A novel basestock composite comprising two copper conducting sheets bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to a release layer which is not coextensive with the borders of the insulator layers such that when the basestock is cut at a point internal to its borders and into the release layer the two basestock composites can be separated.

Fabrication multilayer combined rigid/flex printed circuit board

A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, the conductor layer containing at least one conductive pathway and the flexible insulator layer comprises fibers dispersed in a matrix polymer. The fibers are oriented with respect to the conductive pathway so that the conductive pathway is substantially non-aligned with said fibers, substantially along an entirety of the conductive pathway in the flex section so as to be flexible.

Rigid/flex printed circuit board using angled prepreg

Fabrication multilayer combined rigid/flex printer circuit board

Multilayer rigid flex printed circuits are fabricated from a novel basestock composite comprising two copper conducting sheets, bonded to insulator layers comprised of fiberglass sheets impregnated with an adhesive such as epoxy, wherein the insulator layers are both affixed to Kapton layers wherein said Kapton layers are not coextensive with the borders of the insulator layers. The basestock composite can then be imaged and etched on the conductor layers to form conductor patterns, laminated or coated with a coverlay of dielectric material, and the basestock can be cut at a point internal to its borders and into the Kapton layers thereby separating two imaged and etched conductor layers.

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Hudson, NH, United States of America

A Roland Caron