Other

Alpha Fry Limited

Staystik, Inc.

Shores, a. Andrew

A Andrew Shores

An isocyanate adduct comprising the reaction product of a composition comprising in admixture a polyisocyanate, a silicone having dimethylsiloxane segments containing one or more of an isocyanate-reactive group bonded to said segments through an intermediate organic group, a reactant containing one or more of an isocyanate-reactive group, and one or more acid group or amine group, optionally an organic substance having one or more isocyanate-reactive groups, and compound providing counterion for said acid or amine group, wherein either the silicone, or the reactant, or both, have a single isocyanate-reactive group.

Silicone and ionically modified isocyanate adduct

Reaction product of a composition comprising in admixture a polyisocyanate, a silicone having dimethylsiloxane segments containing one or more isocyanate-reactive group, a reactant containing one or more of an isocyanate-reactive group and one or more ionizable group, optionally an organic substance having one or more isocyanate-reactive groups and no ionizable group, and compound providing counterion for said ionizable group, wherein either the silicone, or the reactant, or both, have a single isocyanate-reactive group.

A urethane oligomer comprising the reaction product of a composition comprising in admixture a polyisocyanate, a silicone having dimethylsiloxane segments containing two or more of an isocyanate-reactive group, a reactant containing two or more of an isocyanate-reactive group, and one or more acid group or amine group, optionally an organic substance having one or more isocyanate-reactive group, and compound providing counterion for said acid or amine group, wherein said oligomer is dissolved at concentrations higher than 40%, its average degree of polymerization is less than 50 and its weight average molecular weight is less than 20,000.

Silicone and ionically modified urethane oligomer

This invention describes a composition of matter having moisture gettering properties and applicable as coating or adhesive in a hermetic microelectronic device. The composition is applied to the interior surface of the packaging at a thickness of 0.1-25 mil and comprises a desiccant finely dispersed in a binder which is a water vapor permeable solid material. This may be a polymer, porous ceramic or glass. The desiccant is a particulate solid with 0.2-100 micrometer average particle size. It ought to be able to absorb from a one atmosphere pressure gas containing one volume percent water vapor at least four parts by weight of water vapor per 100 parts by weight of desiccant at 25.degree. C., and for high reliability devices, it should also be able to absorb at least two parts by weight of water vapor per 100 parts by weight of desiccant at 100.degree. C. The desiccant to binder volume ratio ought to be between 0.002 and 2. Molecular sieves are especially useful as the desiccant component of the composition of this invention.

Moisture getting composition for hermetic microelectronic devices

An acqueous solution of a dimethylsiloxane containing polyelectrolyte is provided. It incorporates:

Process of manufacturing a coated article

A method of making a sealed enclosure for an electronic device utilizes a coating or adhesive with desiccant properties. The coating or adhesive comprises a protonated alumino silicate powder dispersed in a polymer.

Method of providing moisture-free enclosure for electronic device

A microelectronic device containing one or more dies bonded to a substrate 0.5-8 mil thick thermoplastic adhesive film is disclosed. The adhesive's main constituent is a thermoplastic organic high polymer containing the elements of carbon and hydrogen, and one or more of the elements oxygen, nitrogen, sulfur, halogen in its repeating unit. The polymer's Vicat softening temperature is 30.degree.280.degree. C., preferably 70.degree.-230.degree. C. The adhesive may also contain up to 45 volume percent of a thermally conductive inorganic filler of 0.5-20 micrometer particle size. The attachment process simply consists of heating and pressing the film, sandwiched between the adherent surfaces, above the melting temperature and cooling to ambient.

Die attach adhesive film, application method and devices incorporating

An alkali dispersible copolymer is provided which is the reaction product of a di-omegaorgano functional dimethylsiloxane oligomer having terminal active hydrogen groups, a carboxyl group bearing monomer, and a diisocyanate. The copolymer provides good release per se from tacky adhesive masses or when combined with other film formers.

Release coating for adhesive tapes and labels

An enclosure for providing both a moisture free and particle free environment is disclosed. A portion of the inner surface of the enclosure, that comprises an electronic device sealed in a container, is coated with a pressure sensitive adhesive comprising 4-40 percent, by volume, of a solid desiccant. The preferred adhesive is a silicone pressure sensitive adhesive and the preferred desiccant is zeolite.

Moisture and particle getter for enclosures

A sealed enclosure of an electronic device incorporates a coating or adhesive with desiccant properties. The coating or adhesive comprises a protonated alumino silicate powder dispersed in a polymer.

Enclosure for electronic devices

A heat activated adhesive film is disclosed, 2-15 mil thick, for bonding a circuit-printed substrate to its support. The adhesive's main constituent is a thermoplastic organic high polymer containing the elements of carbon and hydrogen, and one or more of the elements oxygen, nitrogen, sulfur, halogen in its repeating unit. The polymer's Vicat softening temperature is 70.degree.-280.degree. C. Optionally, the adhesive may also contain up to 45 volume percent of a thermally conductive inorganic filler of 0.5-20 micrometer particle size. The attachment process simply consists of heating and pressing the film, sandwiched between the adherent surfaces, above the melting temperature and cooling to ambient.

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Venice, CA, United States of America

A Andrew Shores