Kouji Morita

Title: Kouji Morita: Innovator in Resin Composition and Multilayer Printed Wiring Board

Introduction

Kouji Morita is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of resin compositions and multilayer printed wiring boards. With a total of 4 patents to his name, Morita's work has had a substantial impact on various industries.

Latest Patents

Morita's latest patents include innovative developments in resin compositions and laminate sheets. One of his notable inventions relates to a resin composition that comprises an (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group, along with a thermoplastic resin. Another significant patent focuses on a resin composition containing (A) a compound with a maleimide group, a divalent group with at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group, as well as (B) a halogen-free flame retardant. These inventions are crucial for the advancement of multilayer printed wiring boards and printed wiring boards for millimeter-wave radar.

Career Highlights

Throughout his career, Kouji Morita has worked with notable companies such as Kao Corporation and Showa Denko Materials Co., Ltd. His experience in these organizations has allowed him to refine his expertise in resin technology and contribute to innovative solutions in the industry.

Collaborations

Morita has collaborated with esteemed colleagues, including Takao Tanigawa and Tetsuroh Irino. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Kouji Morita's contributions to resin compositions and multilayer printed wiring boards highlight his innovative spirit and dedication to advancing technology. His patents and collaborations reflect a commitment to excellence in the field.