Simodate, Japan

Kazuya Matsuda


Average Co-Inventor Count = 5.0

ph-index = 3

Forward Citations = 40(Granted Patents)


Company Filing History:


Years Active: 2000-2005

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3 patents (USPTO):Explore Patents

Title: Kazuya Matsuda: Innovator in Electronic Parts Technology

Introduction

Kazuya Matsuda is a notable inventor based in Simodate, Japan. He has made significant contributions to the field of electronic parts technology, holding a total of 3 patents. His work focuses on innovative methods for mounting electronic components, which enhance the efficiency and reliability of electronic devices.

Latest Patents

Matsuda's latest patents include an invention for adhesive-coated electronic parts on a connection sheet. This apparatus features a connection sheet with a separator layer and an adhesive film layer that can be peeled away. The cohesive strength of the adhesive film layer is designed to decrease when heated to a predetermined temperature. Each electronic part has an electrode surface, and the adhesive film layer coats all exposed portions of the electrode surface, ensuring a secure attachment. Another significant patent involves a method for mounting multiple electronic parts on a circuit board, utilizing similar technology to improve the assembly process.

Career Highlights

Kazuya Matsuda is currently employed at Hitachi Chemical Company, Ltd., where he continues to develop innovative solutions in electronic parts technology. His work has been instrumental in advancing the capabilities of electronic components, making them more efficient and easier to manufacture.

Collaborations

Matsuda has collaborated with several talented individuals in his field, including Isao Tsukagoshi and Kouji Kobayashi. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Kazuya Matsuda is a prominent figure in the realm of electronic parts innovation. His patents and contributions to the industry reflect his commitment to advancing technology and improving electronic component assembly.

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