Bronx, NY, United States of America

Julian Juu-Chuan Hsieh


Average Co-Inventor Count = 2.7

ph-index = 2

Forward Citations = 71(Granted Patents)


Company Filing History:


Years Active: 1994-1999

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2 patents (USPTO):Explore Patents

Title: Innovations by Julian Juu-Chuan Hsieh

Introduction

Julian Juu-Chuan Hsieh is a notable inventor based in the Bronx, NY. He has made significant contributions to the field of material deposition technology, holding two patents that showcase his innovative approaches. His work primarily focuses on improving the uniformity and efficiency of deposition processes.

Latest Patents

Hsieh's latest patents include a method for selective material deposition on one side of raised surfaces. This invention utilizes an apparatus that employs angled sputtering with a collimation grid. The design limits the distribution of particle trajectories, resulting in improved uniformity of deposition on surfaces at high angles. This method allows for enhanced deposition on sidewalls and filling of recessed features, particularly those with high aspect ratios. His second patent involves a system for controlling the thickness profile of deposited thin film layers over three-dimensional topography. This innovative approach enables the creation of new shapes for thin film layers, including tapered structures and voidless filling of trenches.

Career Highlights

Julian Juu-Chuan Hsieh is currently employed at International Business Machines Corporation (IBM). His work at IBM has allowed him to explore advanced techniques in chemical vapor deposition and material science. Hsieh's contributions have been instrumental in pushing the boundaries of what is possible in thin film technology.

Collaborations

Some of Hsieh's notable coworkers include Donald M Kenney and Thomas John Licata. Their collaborative efforts have further advanced the research and development of innovative deposition methods.

Conclusion

Julian Juu-Chuan Hsieh's work exemplifies the spirit of innovation in material deposition technology. His patents reflect a deep understanding of the complexities involved in achieving precise and efficient deposition processes. Hsieh continues to contribute to advancements in the field, making a lasting impact on technology.

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