Jing Ren

Title: Jing Ren: Innovator in Chemical Mechanical Polishing Technology

Introduction

Jing Ren is a notable inventor based in Hockessin, DE (US), recognized for her contributions to the field of chemical mechanical polishing (CMP) technology. With a focus on developing advanced polishing pads, her work has significant implications for the electronics industry.

Latest Patents

Jing Ren holds a patent titled "Formulations for high porosity chemical mechanical polishing pads with high hardness and CMP pads made therewith." This invention provides CMP polishing pads or layers that possess a unfilled Shore D (2 second) hardness ranging from 57-77 or a filled Shore D (2 second) hardness from 18-50. The pads are created from a two-component reaction mixture, which includes a liquid aromatic isocyanate component and a liquid polyol component with specific curatives.

Career Highlights

Jing Ren is currently employed at Rohm and Haas Electronic Materials CMP Holdings, Inc., where she applies her expertise in developing innovative materials for CMP applications. Her work has contributed to advancements in the performance and efficiency of polishing processes used in semiconductor manufacturing.

Collaborations

Jing has collaborated with notable colleagues, including Kwadwo E Tettey and Bryan E Barton, to further enhance the development of CMP technologies. Their combined efforts have led to significant improvements in the quality and effectiveness of polishing pads.

Conclusion

Jing Ren's innovative work in the field of chemical mechanical polishing exemplifies her commitment to advancing technology in the electronics sector. Her contributions continue to shape the future of CMP applications, making her a key figure in this specialized area of research.