Jae Sik Chung

Title: Jae Sik Chung: Innovator in Wafer-Level Electronic Modules

Introduction

Jae Sik Chung is a prominent inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the field of electronic modules, particularly through his innovative patent related to wafer-level technology. His work is instrumental in advancing the capabilities of electronic devices.

Latest Patents

Jae Sik Chung holds a patent for "Wafer-level electronic modules with integral connector contacts." This invention involves an electronic module that comprises a monolithic microelectronic substrate, which includes at least one integrated circuit die. The substrate features a redistribution structure that provides a connector contact coupled to the integrated circuit die. This design allows for enhanced connectivity and functionality in electronic devices. The patent also discusses methods for fabricating these electronic modules, showcasing Chung's expertise in the field.

Career Highlights

Chung is associated with Samsung Electronics Co., Ltd., a leading company in the technology sector. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to the development of innovative electronic solutions. His patent reflects his commitment to improving electronic module design and functionality.

Collaborations

Jae Sik Chung has collaborated with notable colleagues, including Seung Duk Baek and Dong Hyeon Jang. These collaborations have likely enriched his work and contributed to the success of his inventions.

Conclusion

Jae Sik Chung is a noteworthy inventor whose contributions to wafer-level electronic modules have the potential to impact the electronics industry significantly. His innovative patent and work at Samsung Electronics Co., Ltd. highlight his role as a leader in technological advancements.