Hsiang-Hou Tseng

Title: Hsiang-Hou Tseng: Innovator in Connector Technology

Introduction

Hsiang-Hou Tseng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of connector technology, particularly through his innovative patent.

Latest Patents

Hsiang-Hou Tseng holds a patent for a "Connector and method for forming the same." This patent describes a method that includes forming a first connector and a second connector over a first wafer and a second wafer, respectively. Each connector is created by forming an opening in a dielectric layer, depositing a first metal layer with a nano-twinned structure, and then depositing a second metal layer made of different materials. The process culminates in a thermo-compression method to bond the two wafers together. He has 1 patent to his name.

Career Highlights

Throughout his career, Hsiang-Hou Tseng has worked with prominent organizations, including Taiwan Semiconductor Manufacturing Company Ltd. and National Yang Ming Chiao Tung University. His experience in these institutions has allowed him to refine his skills and contribute to advancements in semiconductor technology.

Collaborations

Hsiang-Hou Tseng has collaborated with various professionals in his field, including his coworker Chih Hung Chen. These collaborations have further enhanced his research and development efforts.

Conclusion

Hsiang-Hou Tseng is a distinguished inventor whose work in connector technology has made a lasting impact. His innovative methods and collaborations continue to influence the industry.