Yokohama, Japan

Hirotaka Nakano


Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 129(Granted Patents)


Location History:

  • Yokahama, JP (1984)
  • Yokohama, JP (1982 - 1989)

Company Filing History:


Years Active: 1982-1989

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6 patents (USPTO):Explore Patents

Title: Hirotaka Nakano: Innovator in Electronic Bonding Technologies

Introduction

Hirotaka Nakano is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of electronic bonding technologies, holding a total of 6 patents. His innovative work focuses on improving the efficiency and effectiveness of bonding methods used in electronic components.

Latest Patents

Hirotaka Nakano's latest patents include a bonding sheet for electronic components and a method of bonding electronic parts. The bonding sheet comprises a substrate with an opening and a low-melting point bonding metal that either closes the opening or is arranged on the peripheral portion to project into the opening. This design allows for the bonding of a large number of electrode terminals through a single operation, utilizing thermocompression at low temperatures without melting the bonding metal. Additionally, his film carrier invention features a base film with multiple conductors and layers made of low-melting point bonding metal. The bonding method involves aligning these layers with electronic part terminals and half-melting them to create electrical connections, all while minimizing damage to sensitive components.

Career Highlights

Throughout his career, Hirotaka Nakano has worked with notable companies such as Toshiba Corporation and Tokyo Shibaura Electric Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic bonding technologies.

Collaborations

Hirotaka Nakano has collaborated with esteemed colleagues, including Thunekazu Yoshino and Hiroshi Morita. Their combined expertise has further propelled innovations in the field.

Conclusion

Hirotaka Nakano's contributions to electronic bonding technologies have established him as a key figure in the industry. His innovative patents and collaborations continue to influence advancements in electronic component manufacturing.

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