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For the Inventor, By the Inventor

Graefelfing, Germany

Christof Landesberger

USPTO Granted Patents = 13 

 

Average Co-Inventor Count = 2.1

ph-index = 5

Forward Citations = 104(Granted Patents)


Location History:

  • München, DE (2001)
  • Graefelfing, DE (2010 - 2019)
  • Gräfelfing, DE (2020)
  • Munich, DE (2002 - 2024)

Company Filing History:

goldMedal13 out of 4,804 
 
Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
 patents

Years Active: 2001-2024

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13 patents (USPTO):Explore Patents
1. 11901285 - Microelectronic arrangement and method for manufacturing the same (2024-02-13),
2. 11570898 - Multi-layer 3D foil package (2023-01-31),
3. 10752499 - Method for manufacturing planar thin packages (2020-08-25),
4. 10304714 - Device comprising film for electrostatic coupling of a substrate to a substrate carrier (2019-05-28),
5. 9978626 - Carrier wafer, method for holding a flexible substrate and method for the manufacture of a carrier wafer (2018-05-22),
6. 8563358 - Method of producing a chip package, and chip package (2013-10-22),
7. 8198135 - Method for producing flexible integrated circuits which may be provided contiguously (2012-06-12),
8. 7733624 - Method and device for electrostatic fixing of substrates with polarized molecules (2010-06-08),
9. 7027283 - Mobile holder for a wafer (2006-04-11),
10. 6756288 - Method of subdividing a wafer (2004-06-29),
11. 6514790 - Method for handling a plurality of circuit chips (2003-02-04),
12. 6444493 - Method for vertically integrating active circuit planes and vertically integrated circuit produced using said method (2002-09-03),
13. 6328841 - Process for joining inorganic substrates in a permanent manner (2001-12-11),

Title: Christof Landesberger: Innovator in Microelectronics

Introduction

Christof Landesberger is a prominent inventor based in Graefelfing, Germany. He has made significant contributions to the field of microelectronics, holding a total of 13 patents. His work focuses on innovative methods and arrangements that enhance the functionality and efficiency of electronic components.

Latest Patents

Among his latest patents is a microelectronic arrangement and method for manufacturing the same. This invention provides a method for creating a chip-film module that includes a semiconductor chip and a film substrate. The method involves embedding the chip-film module into a printed circuit board, ensuring effective electrical coupling. Another notable patent is the multi-layer 3D foil package, which features a foil substrate stack with multiple foil planes. This design allows for the arrangement of functional electronic components within a cavity, optimizing space and performance.

Career Highlights

Christof Landesberger is affiliated with the Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V., a leading research organization in Germany. His work at this institution has allowed him to push the boundaries of microelectronic technology and contribute to advancements in the field.

Collaborations

He has collaborated with notable colleagues, including Michael Feil and Armin Klumpp, to further enhance his research and development efforts. Their combined expertise has led to innovative solutions in microelectronics.

Conclusion

Christof Landesberger's contributions to microelectronics through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced electronic technologies.

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