Cheolsoo Han

Title: Cheolsoo Han: Innovator in Semiconductor Packaging

Introduction

Cheolsoo Han is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include a semiconductor package that features a substrate with substrate pads on its top surface. This package incorporates a first upper semiconductor chip with conductive chip pads and bonding wires that connect the substrate pads to the chip. The design includes first and second bonding wires, with specific vertical levels on different regions of the substrate. Another notable patent is a semiconductor package that consists of a lower substrate with a conductive line, a first semiconductor chip, and an under-fill layer. This under-fill layer has a central part and an edge part, with a recess region defined by the sidewalls of these parts.

Career Highlights

Cheolsoo Han is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the efficiency and reliability of semiconductor packages.

Collaborations

He collaborates with talented coworkers, including Raehyung Do and Seunghyun Go, who contribute to the innovative environment at Samsung Electronics.

Conclusion

Cheolsoo Han's contributions to semiconductor packaging reflect his dedication to innovation and excellence in technology. His patents not only enhance the functionality of semiconductor devices but also pave the way for future advancements in the industry.