Taejeon, South Korea

Byung Sung Kang


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Byung Sung Kang: Innovator in Heteroepitaxial Thin Films

Introduction

Byung Sung Kang is a prominent inventor based in Taejeon, South Korea. He has made significant contributions to the field of semiconductor technology, particularly in the preparation of heteroepitaxial thin films. His innovative methods have the potential to enhance the performance of various electronic devices.

Latest Patents

Byung Sung Kang holds a patent for a "Method for preparing heteroepitaxial thin film." This patent discloses a method that allows for the preparation of heteroepitaxial thin films free of island structures, which negatively impact the photoelectric properties and interfacial reactivity of the films. The method involves depositing these thin films on grooved or curved surfaces of substrates. By utilizing grooved substrates, the coherent elastic strain from the thin films is relieved, which inhibits surface roughening and the formation of island structures. This technique can be applied to various thin films, including GaAs/Si and SiGe/Si, commonly used in semiconductor devices, enabling flat deposition at significant thicknesses without additional processing.

Career Highlights

Byung Sung Kang is affiliated with the Korea Advanced Institute of Science and Technology, where he continues to advance research in semiconductor technologies. His work has garnered attention for its practical applications in the electronics industry.

Collaborations

He has collaborated with notable colleagues, including Sung Yoon Chung and Suk Pil Kim, contributing to the advancement of research in their field.

Conclusion

Byung Sung Kang's innovative methods in the preparation of heteroepitaxial thin films represent a significant advancement in semiconductor technology. His contributions are poised to impact the efficiency and performance of electronic devices in the future.

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