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Sts Semiconductor & Telecommunications Co., Ltd.

USPTO Granted Patents = 16

Forward Citations = 82

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19 inventors (with patents filed for the assignee):

Jung Hwan Chun (6 out of 6 patents)

Jai Kyoung Choi (3 out of 6 patents)

Eun Dong Kim (3 out of 6 patents)

4. Hyun Hak Jung (2 out of 4 patents)

5. Sun Ha Hwang (2 out of 2 patents)

6. Jong Won Lee (2 out of 75 patents)

7. Gyu Han Kim (2 out of 2 patents)

8. Seung Hoon Oh (1 out of 13 patents)

9. Young Seok Lee (1 out of 2 patents)

10. DaeSik Choi (1 out of 78 patents)

11. Hyeong Min Kim (1 out of 2 patents)

12. Su Kyung Lim (1 out of 2 patents)

13. You Jin Oh (1 out of 1 patent)

14. Hee Cheol Kim (1 out of 4 patents)

15. Jae Bok Yoo (1 out of 1 patent)

16 patents: Sort by Forward Citations

1. 9905551 - Method of manufacturing wafer level packaging including through encapsulation vias (2018-02-27),

2. 9905436 - Wafer level fan-out package and method for manufacturing the same (2018-02-27),

3. 9466586 - Method for manufacturing wafer-level fan-out package (2016-10-11),

4. 9449911 - Fan-out wafer level package and manufacturing method thereof (2016-09-20),

5. 9349667 - Method of manufacturing stacked package (2016-05-24),

6. 9024452 - Semiconductor package comprising an interposer and method of manufacturing the same (2015-05-05),

7. 8952514 - Semiconductor package (2015-02-10),

8. 8941225 - Integrated circuit package and method for manufacturing the same (2015-01-27),

9. 8912662 - Wafer-level package and method of manufacturing the same (2014-12-16),

10. 8802498 - Method of manufacturing semiconductor package having no chip pad (2014-08-12),

11. 8785254 - Method of manufacturing high-capacity semiconductor package (2014-07-22),

12. 8742551 - Semiconductor package and method of manufacturing the same (2014-06-03),

13. 8424195 - Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same (2013-04-23),

14. 8222120 - Method of dicing wafer using plasma (2012-07-17),

15. 8202744 - Wafer through silicon via forming method and equipment therefor (2012-06-19),

STS Semiconductor & Telecommunications Co., Ltd. is a leading industry expert in semiconductors and telecommunications solutions. With a strong focus on research and development, they design and produce cutting-edge semiconductor technologies to meet the growing demands of various industries. The company also offers comprehensive telecommunications services, delivering innovative solutions for improved communication and connectivity. Through their advanced products and services, STS Semiconductor & Telecommunications Co., Ltd. empowers businesses and individuals to thrive in a connected world.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

16 Patents

#25 in

#706 in South Korea

#36,634 in the World

Sts Semiconductor & Telecommunications Co., Ltd.

Forward Citations = 82

19 inventors:

Jung Hwan Chun (6 out of 6 patents)

Jai Kyoung Choi (3 out of 6 patents)

Eun Dong Kim (3 out of 6 patents)

4. Hyun Hak Jung (2 out of 4 patents)

5. Sun Ha Hwang (2 out of 2 patents)

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