For the Inventor, By the Inventor

Enter assignee name

Shanghai, China

At&s (china) Co. Ltd.

USPTO Granted Patents = 36

EPO Patents = 10

Forward Citations = 12

Loading Chart...

Loading Chart...

31 inventors (with patents filed for the assignee):

Mikael Tuominen (20 out of 36 patents)

Seok Kim Tay (13 out of 24 patents)

Nick Xin (7 out of 9 patents)

4. Artan Baftiri (6 out of 8 patents)

5. Annie Tay (5 out of 6 patents)

6. Mikael Tuominen (5 out of 7 patents)

7. Sally Sun (3 out of 4 patents)

8. Nikolaus Bauer-Öppinger (3 out of 3 patents)

9. Wilhelm Tamm (3 out of 4 patents)

10. Yee-Bing Ling (2 out of 3 patents)

11. Kim Liu (2 out of 3 patents)

12. Henry Guo (2 out of 2 patents)

13. Nikolaus Bauer-Oeppinger (2 out of 2 patents)

14. Giordano DiGregorio (2 out of 2 patents)

15. Philips Dai (2 out of 2 patents)

36 patents: Sort by Forward Citations

1. 12490376 - Component carrier with asymmetric build-up and methods for determining a design of and manufacturing the same (2025-12-02),

2. 12127338 - Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus (2024-10-22),

3. 12048101 - Component carrier with well-defined outline sidewall cut by short laser pulse and/or green laser (2024-07-23),

4. 11963310 - Component carrier having component covered with ultra-thin transition layer (2024-04-16),

5. 11937369 - Traceability of subsequent layer structure manufacturing of main body for component carriers by means of laterally and vertically displaced information carrying structures (2024-03-19),

6. 11700690 - Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule (2023-07-11),

7. 11688668 - Component carrier with low shrinkage dielectric material (2023-06-27),

8. 11672079 - Component carrier with improved bending performance (2023-06-06),

9. 11670613 - Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing method (2023-06-06),

10. 11589462 - Semi-flexible component carrier with stepped layer structure (2023-02-21),

11. 11470714 - Component carrier with embedded component and horizontally elongated via (2022-10-11),

12. 11452212 - Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partially (2022-09-20),

13. 11343916 - Component carrier and method of manufacturing the same (2022-05-24),

14. 11330706 - Component carrier with embedded large die (2022-05-10),

15. 11291119 - Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulus (2022-03-29),

AT&S (China) Co. Ltd. is a leading manufacturer of high-quality printed circuit boards (PCBs) and substrates in China. As a subsidiary of the AT&S Group, the company is committed to providing advanced interconnect solutions to a range of industries, including automotive, industrial, telecommunications, and consumer electronics. With state-of-the-art manufacturing facilities and a strong focus on technological innovation, AT&S (China) Co. Ltd. strives to meet the evolving needs of its customers and contribute to the development of the electronics industry in China.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 2 2025

36 Patents

#80 in Shanghai

#786 in China

#18,140 in the World

Shanghai, China

At&s (china) Co. Ltd.

Forward Citations = 12

31 inventors:

Mikael Tuominen (20 out of 36 patents)

Seok Kim Tay (13 out of 24 patents)

Nick Xin (7 out of 9 patents)

4. Artan Baftiri (6 out of 8 patents)

5. Annie Tay (5 out of 6 patents)

Please report any incorrect information to support@idiyas.com

Loading…